Enhanced thermal-conductive and anti-dripping properties of polyamide composites by 3D graphene structures at low filler content

Li, Xuheng; Shao, Linbo; Song, Na; Shi, Liyi; Ding, Peng

doi:10.1016/j.compositesa.2016.06.007

Cited by 120 publications

(59 citation statements)

References 51 publications

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“…By backfilling PMMA into the pores of GFs, 3D thermal conductive paths could be formed in the nanocomposite at an extremely low concentration of GF, and thus a significant increases of thermal conductivity could be achieved (0.35-0.70 W·m -1 ·K -1 ) [207]. Li et al [289] also reported that the thermal conductivity of polyamide-6 (PA6) based nanocomposite filled with 3D GF could be improved by 300 % to 0.847 W·m -1 ·K -1 at a GF loading of 2.0 wt%. Fig.…”

Section: D Foam Fillersmentioning

confidence: 99%

Thermal conductivity of polymers and polymer nanocomposites

Huang

Qian

Yang

2018

Materials Science and Engineering: R: Reports

640

391

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Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In this review article, we aim to: 1). systematically summarize the molecular level understanding on the thermal transport mechanisms in polymers in terms of polymer morphology, chain structure and inter-chain coupling; 2). highlight the rationales in the recent efforts in enhancing the thermal conductivity of nanostructured polymers and polymer nanocomposites. Finally, we outline the main advances, challenges and outlooks for highly thermal-conductive polymer and polymer nanocomposites. the inter-chain coupling. Fig. 1 Schematic diagrams of a polymer: (a) the morphology of a polymer consisting of crystalline and amorphous domains; (b) structure of a polymer chain.In addition to engineering the morphology of polymer chains, another common method to enhance the thermal conductivity of polymers is to blend polymers with highly thermal conductive fillers. The progress of nanotechnology over the last two decades not only provides more diverse high thermal conductivity fillers of different material types and topological shapes but also advances the understanding at the nanoscale. Fig. 2 shows a sketch of a polymer nanocomposite to illustrate the thermal transport mechanisms. In general, there are two types of polymer nanocomposites depending on whether nano-fillers form a network or not. When the filler concentration is low, no inter-filler networks could be formed, as shown in Fig. 2(a). The thermal conductivity is essentially determined by the filler-matrix coupling, i.e, interfacial thermal resistance, and the concentration and the geometric shapes of fillers. When the filler concentration is large enough, high conductivity fillers might form thermally conductive networks, as shown in Fig. 2(b). Although nanocomposites with filler network could possess a higher thermal conductivity than that without a network, their thermal conductivity could still be low due to the large inter-filler thermal contact resistance. Recently, three-dimensional fillers, such as carbon and graphene foams, have drawn a lot of attention. The fundamental thermal transport mechanisms and recent synthesis efforts in both types of nanocomposites are reviewed.This review article is organized as follows. In Section 2, we introduce the experimental progress on the enhancement of thermal conductivity by aligning polymer chains, and then review the methods to further tune the thermal conductivity by engineering chain structure and inter-chain coupling, as illustrated in Fig. 3(a). In Section 3, we discuss the thermal conductivity of polymer nanocomposites both with and without inter...

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Section: D Foam Fillersmentioning

confidence: 99%

Thermal conductivity of polymers and polymer nanocomposites

Huang

Qian

Yang

2018

Materials Science and Engineering: R: Reports

640

391

View full text Add to dashboard Cite

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“…The TC of GF/PDMS reaches 0.55 W m −1 K −1 , increased by 162% comparing with that of PDMS. In Li's work, self‐supported 3D graphene structure was introduced into the polyamide‐6 (PA6) matrix. As a result, the TC of the composite was increased by 300% from 0.210 to 0.847 W m −1 K −1 at 2.0 wt% graphene loading.…”

mentioning

confidence: 99%

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

Zhang

Kong

Tao

et al. 2019

Adv Materials Inter

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“…Polymers possess light weight, high specific strength and modulus, excellent electrical insulating properties, good processability, excellent chemical stability, and low cost [1][2][3][4][5][6] and have been widely applied in the fields of electronics [7], biology [8], medicine [9], energy [10], and manufacturing industry [11], etc. Unfortunately, the intrinsic low thermally conductive coefficient (λ) and insufficient thermal stability of polymeric matrix have restricted its broader application in the areas which require good heat dissipation and low thermal expansion [12][13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

294

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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Enhanced thermal-conductive and anti-dripping properties of polyamide composites by 3D graphene structures at low filler content

Cited by 120 publications

References 51 publications

Thermal conductivity of polymers and polymer nanocomposites

Thermal conductivity of polymers and polymer nanocomposites

3D Thermally Cross‐Linked Graphene Aerogel–Enhanced Silicone Rubber Elastomer as Thermal Interface Material

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

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