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2022
DOI: 10.1016/j.compscitech.2022.109536
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Enhanced thermal conduction of hybrid filler/polydimethylsiloxane composites via a continuous spatial confining process

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Cited by 22 publications
(18 citation statements)
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“…Figure 3 d shows the temperature variation curve of different CNT-Gr/PDMS composites after heating the LED chip for 150 s. After 150 s of heating to stabilize, the surface temperature of the chip using the CNT-Gr(3:1)/PDMS composite as the TIM reached ~52.8 °C, lower than the surface stabilization temperature of the CNT-Gr(1:1)/PDMS and CNT-Gr(1:3)/PDMS composites. At the same filler content (12 wt%), the thermal conductivity of our CNT-Gr(3:1)/PDMS composites prepared by the UAFI method is higher than that of hexagonal boron nitride/multiwall carbon nanotubes/PDMS prepared by the continuous space-confining method [ 7 ]. The above results show that the CNT-Gr(3:1)/PDMS composites prepared by the UAFI method have the best thermal conductivity and thermal management properties.…”
Section: Resultsmentioning
confidence: 99%
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“…Figure 3 d shows the temperature variation curve of different CNT-Gr/PDMS composites after heating the LED chip for 150 s. After 150 s of heating to stabilize, the surface temperature of the chip using the CNT-Gr(3:1)/PDMS composite as the TIM reached ~52.8 °C, lower than the surface stabilization temperature of the CNT-Gr(1:1)/PDMS and CNT-Gr(1:3)/PDMS composites. At the same filler content (12 wt%), the thermal conductivity of our CNT-Gr(3:1)/PDMS composites prepared by the UAFI method is higher than that of hexagonal boron nitride/multiwall carbon nanotubes/PDMS prepared by the continuous space-confining method [ 7 ]. The above results show that the CNT-Gr(3:1)/PDMS composites prepared by the UAFI method have the best thermal conductivity and thermal management properties.…”
Section: Resultsmentioning
confidence: 99%
“…Thermal interface materials (TIM) with good thermal conductivity are therefore urgently needed to improve the heat dissipation capability of devices [ 3 , 4 , 5 ]. Thermal conductive polymer composites are gaining interest and application as thermal management materials in the microelectronics and energy industries due to their low cost, good chemical resistance, light weight, and excellent mechanical properties [ 6 , 7 , 8 , 9 , 10 , 11 ]. However, the inherent low thermal conductivity of polymeric materials (0.1 to 0.5 W/(m·K)) limits their engineering applications as thermal management materials [ 12 , 13 , 14 , 15 , 16 , 17 ].…”
Section: Introductionmentioning
confidence: 99%
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“…Fu et al [ 143 ] constructed the network structure of hexagonal boron nitride and multiwalled carbon nanotubes in polydimethylsiloxane matrix by the continuous spatial confining forced network assembly (CSNA) method. The preparation process and the heat transfer pathways formed are shown in Figure 11 .…”
Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning
confidence: 99%
“…To date, a hydrogel electrolyte with simultaneously high ionic conductivity and superior mechanical properties remains a challenge for Al−air batteries. 41 We envision a high-strength framework in an internal electrolyte hydrogel that can serve as a support frame without sacrificing the ionic conductivity of the hydrogel. As known to us, polyurethane (PU), as a new type of matrix polymer, has become increasingly attractive owing to its green biodegradable property, outstanding mechanical strength, and preferable compatibility with other polymers.…”
Section: Introductionmentioning
confidence: 99%