“…Figure 3 d shows the temperature variation curve of different CNT-Gr/PDMS composites after heating the LED chip for 150 s. After 150 s of heating to stabilize, the surface temperature of the chip using the CNT-Gr(3:1)/PDMS composite as the TIM reached ~52.8 °C, lower than the surface stabilization temperature of the CNT-Gr(1:1)/PDMS and CNT-Gr(1:3)/PDMS composites. At the same filler content (12 wt%), the thermal conductivity of our CNT-Gr(3:1)/PDMS composites prepared by the UAFI method is higher than that of hexagonal boron nitride/multiwall carbon nanotubes/PDMS prepared by the continuous space-confining method [ 7 ]. The above results show that the CNT-Gr(3:1)/PDMS composites prepared by the UAFI method have the best thermal conductivity and thermal management properties.…”
Section: Resultsmentioning
confidence: 99%
“…Thermal interface materials (TIM) with good thermal conductivity are therefore urgently needed to improve the heat dissipation capability of devices [ 3 , 4 , 5 ]. Thermal conductive polymer composites are gaining interest and application as thermal management materials in the microelectronics and energy industries due to their low cost, good chemical resistance, light weight, and excellent mechanical properties [ 6 , 7 , 8 , 9 , 10 , 11 ]. However, the inherent low thermal conductivity of polymeric materials (0.1 to 0.5 W/(m·K)) limits their engineering applications as thermal management materials [ 12 , 13 , 14 , 15 , 16 , 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…The GNs/GF/natural rubber composite showed a thermal conductivity enhancement of 8100%, and the thermal conductivity of the composite was enhanced by 1300% for every 1 vol% increase in Gr. Researchers have used the continuous spatial confining method, sol-gel, solution blending, and phase separation to form better thermally conductive networks within the polymer matrix [ 7 , 41 ]. However, these methods involve first blending and then building the thermal conductivity network, whereas UAFI first builds the thermal conductivity network and then introduces it into the matrix.…”
Due to the rapid development of the miniaturization and portability of electronic devices, the demand for polymer composites with high thermal conductivity and mechanical flexibility has significantly increased. A carbon nanotube (CNT)-graphene (Gr)/polydimethylsiloxane (PDMS) composite with excellent thermal conductivity and mechanical flexibility is prepared by ultrasonic-assisted forced infiltration (UAFI). When the mass ratio of CNT and Gr reaches 3:1, the thermal conductivity of the CNT-Gr(3:1)/PDMS composite is 4.641 W/(m·K), which is 1619% higher than that of a pure PDMS matrix. In addition, the CNT-Gr(3:1)/PDMS composite also has excellent mechanical properties. The tensile strength and elongation at break of CNT-Gr(3:1)/PDMS composites are 3.29 MPa and 29.40%, respectively. The CNT-Gr/PDMS composite also shows good performance in terms of electromagnetic shielding and thermal stability. The PDMS composites have great potential in the thermal management of electronic devices.
“…Figure 3 d shows the temperature variation curve of different CNT-Gr/PDMS composites after heating the LED chip for 150 s. After 150 s of heating to stabilize, the surface temperature of the chip using the CNT-Gr(3:1)/PDMS composite as the TIM reached ~52.8 °C, lower than the surface stabilization temperature of the CNT-Gr(1:1)/PDMS and CNT-Gr(1:3)/PDMS composites. At the same filler content (12 wt%), the thermal conductivity of our CNT-Gr(3:1)/PDMS composites prepared by the UAFI method is higher than that of hexagonal boron nitride/multiwall carbon nanotubes/PDMS prepared by the continuous space-confining method [ 7 ]. The above results show that the CNT-Gr(3:1)/PDMS composites prepared by the UAFI method have the best thermal conductivity and thermal management properties.…”
Section: Resultsmentioning
confidence: 99%
“…Thermal interface materials (TIM) with good thermal conductivity are therefore urgently needed to improve the heat dissipation capability of devices [ 3 , 4 , 5 ]. Thermal conductive polymer composites are gaining interest and application as thermal management materials in the microelectronics and energy industries due to their low cost, good chemical resistance, light weight, and excellent mechanical properties [ 6 , 7 , 8 , 9 , 10 , 11 ]. However, the inherent low thermal conductivity of polymeric materials (0.1 to 0.5 W/(m·K)) limits their engineering applications as thermal management materials [ 12 , 13 , 14 , 15 , 16 , 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…The GNs/GF/natural rubber composite showed a thermal conductivity enhancement of 8100%, and the thermal conductivity of the composite was enhanced by 1300% for every 1 vol% increase in Gr. Researchers have used the continuous spatial confining method, sol-gel, solution blending, and phase separation to form better thermally conductive networks within the polymer matrix [ 7 , 41 ]. However, these methods involve first blending and then building the thermal conductivity network, whereas UAFI first builds the thermal conductivity network and then introduces it into the matrix.…”
Due to the rapid development of the miniaturization and portability of electronic devices, the demand for polymer composites with high thermal conductivity and mechanical flexibility has significantly increased. A carbon nanotube (CNT)-graphene (Gr)/polydimethylsiloxane (PDMS) composite with excellent thermal conductivity and mechanical flexibility is prepared by ultrasonic-assisted forced infiltration (UAFI). When the mass ratio of CNT and Gr reaches 3:1, the thermal conductivity of the CNT-Gr(3:1)/PDMS composite is 4.641 W/(m·K), which is 1619% higher than that of a pure PDMS matrix. In addition, the CNT-Gr(3:1)/PDMS composite also has excellent mechanical properties. The tensile strength and elongation at break of CNT-Gr(3:1)/PDMS composites are 3.29 MPa and 29.40%, respectively. The CNT-Gr/PDMS composite also shows good performance in terms of electromagnetic shielding and thermal stability. The PDMS composites have great potential in the thermal management of electronic devices.
“…Fu et al [ 143 ] constructed the network structure of hexagonal boron nitride and multiwalled carbon nanotubes in polydimethylsiloxane matrix by the continuous spatial confining forced network assembly (CSNA) method. The preparation process and the heat transfer pathways formed are shown in Figure 11 .…”
Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning
With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.
“…To date, a hydrogel electrolyte with simultaneously high ionic conductivity and superior mechanical properties remains a challenge for Al−air batteries. 41 We envision a high-strength framework in an internal electrolyte hydrogel that can serve as a support frame without sacrificing the ionic conductivity of the hydrogel. As known to us, polyurethane (PU), as a new type of matrix polymer, has become increasingly attractive owing to its green biodegradable property, outstanding mechanical strength, and preferable compatibility with other polymers.…”
Flexible Al–air batteries with hydrogels are regarded
as
a promising power source owing to their high specific capacity, their
high ionic conductivity, and having no leakage. However, the mechanical
properties of the hydrogels remain unresolved. Here, we present a
polyurethane organic framework (POF) employing a polyurethane skeleton
as an internal support for poly(acrylic acid) (PAA) hydrogel, where
the POF can exhibit high strength and toughness, and an Al–air
battery using the POF can output good electrochemical properties.
The results demonstrate that the tensile stress of 30 ppi POF is 49.5
kPa owing to the stress-transfer mechanism, while that of PAA is only
3.1 kPa. Compared to that of the PAA hydrogel, the discharging capacity
of Al–air batteries with 20 ppi POF can be increased by 79
mAh cm–2 at a current density of 1 mA cm–2, which can be attributed to corrosion inhibition and the surface
roughness change of the POF during the discharging process. This work
will deliver a selectable strategy for a trade-off between mechanical
and electrochemical properties.
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