2015
DOI: 10.1016/j.diamond.2015.06.001
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Enhanced coupling factor of surface acoustic wave devices employing ScAlN/diamond layered structure with embedded electrodes

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Cited by 41 publications
(20 citation statements)
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“…In comparison with layered structure configured with top IDT electrodes, other previous studies have demonstrated the possibility of significant K 2 enhancement of SAW devices based on layered structures by burying the electrodes in the layer of the piezoelectric thin films [1], [6]- [8]. However, the main drawback of such layered structure is that the patterned IDT electrodes harms AlN crystalline growth and causes cracks due to the edge discontinuities of the electrodes [4], [9].…”
Section: Introductionmentioning
confidence: 93%
“…In comparison with layered structure configured with top IDT electrodes, other previous studies have demonstrated the possibility of significant K 2 enhancement of SAW devices based on layered structures by burying the electrodes in the layer of the piezoelectric thin films [1], [6]- [8]. However, the main drawback of such layered structure is that the patterned IDT electrodes harms AlN crystalline growth and causes cracks due to the edge discontinuities of the electrodes [4], [9].…”
Section: Introductionmentioning
confidence: 93%
“…The electrical performance of the fabricated SAW device is comparable to that previously reported for the ScAlN/diamond heterostructures. However, their reflection coefficients in the Rayleigh and Sezawa resonance modes are, to the best of our knowledge, the largest reported in the ScAlN thin‐film SAW technology …”
Section: Resultsmentioning
confidence: 80%
“…The series and ( f s ) and parallel ( f p ) resonance frequencies for the Rayleigh and Sezawa modes are used for computing the effective SAW velocity (Equation ) veff=λ(fnormalpfnormals)/2…”
Section: Resultsmentioning
confidence: 99%
“…Many factors affect the growth of Sc-doped AlN (ScAlN) [7,8] thin films such as sputtering system, substrate, sputtering power, and flow ratio of nitrogen to argon. This Letter describes the preparation and characterisation of Sc 17.5% Al 82.5% N films.…”
mentioning
confidence: 99%