Engineering Plating

Bidmead, G. F.

doi:10.1080/00202967.1981.11870577

Cited by 8 publications

(2 citation statements)

References 4 publications

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“…Electroformed copper articles include band instruments, heat exchangers, reflectors, and a variety of articles for military and aerospace applications. All three main types of printing processes (electrotyping, rotogravure work, and lithography) use copper and sometimes nickel and chromium [42].…”

Section: Applicationsmentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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Polyethylene oxides, glycols, and amines U.S.5,024,736 6/18/91 Clauss et al. Disubstituted ethane sulfonic compounds U.S.4,990,224 2/5/91 Mahmoud Urea, sodium lauryl sulfate, and tosyl or mesyl sulfonic acid U.S.4,975,159 12/4/90 Dahms Alkoxylated lactam amides U.S.4,954,226 9/4/90 Mahmoud Urea and glycerin U.S.4,948,474 8/14/90 Miljkovic Alkylarylene U.S.4,897,165 1/30/90 Bernards et al. Copper/sulfuric acid ratios U.S.4,781,801 11/1/88 Frisby Polyether surfactants þ sulfurized benzene þ grain refiner U.S.4,673,467 6/16/87 Nee Polyethers þ mercaptoimidazole þ sulfurized benzene U.S.4,555,315 11/26/85 Barbieri et al. Polyethers þ organic divalent sulfur compound þ tertiary alkyl amine with polyepichlorohydrin U.S.4,551,212 11/5/85 Rao et al. Phenazine dyestuffs U.S.4,540,473 11/22/83 Bindra et al. S-containing anions other than SO 4 U.S.4,521,282 7/11/84 Tremmel Sulfamic acid U.S.4,490,220 12/25/84 Houman Nitrogen-carbon-sulfur compound U.S.4,430,173 2/7/84 Boudot et al. Sodium salt of W-sulfo-n-propyl N,N-diethyldithiocarbamate, PEG, and crystal violet U.S.4,376,685 6/24/81 Watson Alkylated polyalkyleneimine U.S.4,347,108 8/31/82 Willis Nitrogen-and sulfur-containing compounds U.S.4,336,114 6/22/82 Mayer et al. Phthalocyanine, tertiary alkyl amine with polyepichloro hydrin, polyethyleneimine U.S.4,334,966 12/2/81 Beach et al. Polyether, mercaptoimidazole, sulfurized benzene U.S.4,310,392 1/12/82 Kohl Phenolphthalein U.S.4,272,335 2/19/80 Combs Substituted phthalocyanine radical U.S.4,242,181 12/30/80 Malak Regular coffee U.S.4,134,803 1/16/79 Eckles et al. Disulfides, sulfonic acids, and aliphatic aldehyde U.S.4,110,176 8/29/78 Creutz et al.

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Section: Applicationsmentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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“…Engineering electroplating technology generally involves improving mechanical wear or corrosion protection by applying metal with special physical properties on very small or very large objects [26]. Outdoor objects such as statues and building domes are usually made decorative by plating but the process of doing the plating involves many engineering factors.…”

Section: Decorative and Engineering Platingmentioning

confidence: 99%

Manufacturing Tools

Ritzdorf

2010

Modern Electroplating

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Commercial electroplating began almost two centuries ago. The manufacturing technology for a long time consisted of what we consider the minimum elements needed to deposit metal: open tanks, simple solutions for cleaning, rinsing, and electrodeposition, soluble or insoluble anodes, and a power source. There was virtually no ventilation or proper waste disposal. The entire operation was manual. Electroplating quality depended greatly on the experience and skill of the operator. Certain physical properties of deposits were improved after plating by heat treating or buffing [1]. Over the years the industry grew as an art. Improved processes and techniques were discovered along the way and many were kept secret until others heard about them or stumbled on the technology themselves. Eventually platers began filing patents to protect their rights to discoveries. About the same time entrepreneurs emerged to make a business of developing and selling new ideas for better plating solutions, techniques, and machinery. Following Edison's success with his research laboratory, many industrial companies established their own research and development laboratories, which included electroplating sections supporting manufacturing operations. Electroplating manufacturing technology was developed as needed:(1) to solve production problems, (2) to reduce cost, (3) to increase production rates, (4) to improve quality of the product, and (5) to meet new standards set by product designers and waste disposal regulations. Modern electroplating technologies developed for manufacturing include solutions with the best chemistry available, machines that automatically transport the product through all stages of processing, computerized monitoring, and control systems that also store and process data, online and offline inspection facility, rapid chemical analysis systems, and an efficient waste treatment system. Many developments have resulted from attempts to reduce manufacturing costs, such as increasing production rates with the same equipment, utilizing cheaper materials, or eliminating unnecessary process steps or equipment. Also new technologies originally developed in non-electroplating industries have been adopted for use in advanced electroplating. Software for machine automation, data logging, and data processing are good examples. Equipment designed specifically for electroplating semiconductor wafers and related microelectronic components have brought together all of the advanced control concepts and have led to great improvements in understanding the nature of the electroplating chemistries and processes that have been utilized in these applications.Fully automatic electroplating equipment can be justified only when large volumes of the same or similar product are processed. Modern automatic tools can be operated with fewer operators, but these people often must be more skilled and knowledgeable about instrumentation, sensors, and computers as well as electroplating. ELECTROPLATING EQUIPMENTAutomated plating machines were invented ...

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Electroplating

Schlesinger

2004

Kirk-Othmer Encyclopedia of Chemical Technology

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Electroplating has, over recent decades, evolved from an art to an exact science. This development is seen as responsible for the ever‐increasing number and widening types of applications of this branch of practical science and engineering. Some of the technological areas in which means and methods of electroplating constitute an essential component are all aspects of electronics: macro and micro, optics, opto‐electronics, and sensors of most types, to name only a few. In addition a number of key industries such as the automobile industry (that uses, for example, chrome plating to enhance the corrosion resistance of metal parts) adopt the methods even where other methods, such as evaporation, sputtering, chemical vapor deposition (cvd) and the like are an option. That is so for reasons of economy and convenience. By way of illustration it should be noted that modern electroplating equips the practitioner with the ability to predesign the properties of surfaces and in the case of electroforming those of the whole part. Furthermore, the ability to deposit very thin multilayers (less than a millionth of a cm) via electroplating represents yet a new avenue of producing new materials. A brief historical discussion, the process of electroplating, preparatory (cleaning) steps required, bath formulations, operation conditions as well as the properties of deposits are presented. Recent key changes in the electroplating industry receive special emphasis.

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Engineering Plating

Cited by 8 publications

References 4 publications

Electrodeposition of Copper

Electrodeposition of Copper

Manufacturing Tools

Electroplating

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