2013
DOI: 10.1016/j.ccr.2013.06.015
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Energy-enhanced atomic layer deposition for more process and precursor versatility

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Cited by 89 publications
(83 citation statements)
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References 179 publications
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“…The lower GPC of Al 2 O 3 at higher deposition temperatures [33][34][35]. The reported GPC for PEALD TiO 2 using TTIP in the range of 0.3-0.6 Å/cycle are relatively low, whereas thin films grown from TDMAT, Ti-Prime or Ti-Star have slightly higher growth rates than films grown from TTIP [36][37][38].…”
Section: Characterization Of Ald Thin Filmsmentioning
confidence: 95%
See 1 more Smart Citation
“…The lower GPC of Al 2 O 3 at higher deposition temperatures [33][34][35]. The reported GPC for PEALD TiO 2 using TTIP in the range of 0.3-0.6 Å/cycle are relatively low, whereas thin films grown from TDMAT, Ti-Prime or Ti-Star have slightly higher growth rates than films grown from TTIP [36][37][38].…”
Section: Characterization Of Ald Thin Filmsmentioning
confidence: 95%
“…The reported GPC for PEALD TiO2 using TTIP in the range of 0.3-0.6 Å/cycle are relatively low, whereas thin films grown from TDMAT, Ti-Prime or Ti-Star have slightly higher growth rates than films grown from TTIP [36][37][38]. Very good lateral film thickness uniformity in the reactor is a prerequisite to ensure a uniform coating on a lens surface.…”
Section: Characterization Of Ald Thin Filmsmentioning
confidence: 99%
“…However, for ALD, processes based on such co-reactants have been reported but have gained more attention fairly recently (see Ref. 47 …”
Section: What Can We Learn From Ald?mentioning
confidence: 99%
“…Redistribution subject to ECS terms of use (see 52.41.17. 47 Downloaded on 2018-05-07 to IP reaction mechanisms can take place although most studies so far relied on dissociation (e.g., dissociation of Cl 2 at active surface sites) in combination with desorption reactions, e.g., assisted by ions, electrons, or photons (See The early days of atomic layer etching section). However, many processes relying on other chemistries can also be potentially developed, e.g., as demonstrated in a recent article by Lee and George who developed a thermally driven "reverse ALD" process.…”
Section: And References Therein)mentioning
confidence: 99%
“…Especially in the semiconductor industry, it might be vital not to grow thin films on the complete substrate but only on parts of it, and this can be achieved by area selective ALD. The slow growth rate of ALD can be overcome by coating a large numbers of substrates at the same time, or by using roll-to-roll or spatial ALD technology [51][52][53][54].…”
Section: Atomic Layer Depositionmentioning
confidence: 99%