Energy dissipation and constitutive modeling for a mechanistic description of pad scratching in chemical–mechanical planarization

Ponte, David C.; Meyer, Donna

doi:10.1007/s10854-015-3949-4

Cited by 3 publications

(3 citation statements)

References 19 publications

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“…Mechanical property tests system.-Due to the fact that the tensile and compression property of IC1000 pad shows a great difference 23,24 , the pad properties were characterized in compression mode for CMP analysis. In order to clarify the effect of asperity on pad stiffness and validate the validity of our decomposing method, two kinds of pad samples with diverse surface topography were needed.…”

Section: Methodsmentioning

confidence: 99%

Nonlinear Compression Behavior of the Grooved Polishing Pad: A Model and Its Validation

Zhou

Yan

et al. 2017

ECS J. Solid State Sci. Technol.

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Stiffness analysis of the grooved pad is important to study the mechanical action and slurry flow in CMP process. This paper investigates the nonlinear compression behavior of the grooved pad and then presents a mathematical model to calculate the compressive stiffness of the polishing pad with micro roughness and macro grooved textures. The compressive stiffness of two kinds of pads with different surface structures is analyzed. The results are compared with the FEM model and the uniform thick layer (UTL) model, which are extensively employed in the analysis of pad stiffness. It verifies that the proposed model shows a good agreement with the FEM model. Additional experiments are conducted to validate the accuracy of the proposed semi-empirical formula considering the compressive stiffness of the asperity layer. It is worth mentioning that the error will be more than 24% in calculating the tested grooved pad stiffness by traditional UTL model. In the proposed model, the relationship between the pad stiffness and the geometrical parameters is depicted explicitly, which is convenient for designing the groove structure to achieve a desirable polishing performance.

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Section: Methodsmentioning

confidence: 99%

Nonlinear Compression Behavior of the Grooved Polishing Pad: A Model and Its Validation

Zhou

Yan

et al. 2017

ECS J. Solid State Sci. Technol.

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“…Variations in defects and surface topography may be a result of galvanic corrosion/pitting, micro-scratching, particle contamination, line dishing, or edge-over-erosion, among others. [5][6][7][8][9][10] Modulating the chemical and physical stress at the Cu/slurry/pad interface will be key to limiting post-CMP defects and is controlled by selectively altering slurry chemistry. A typical Cu CMP slurry is a colloidal dispersion of nanoparticles coupled with chemical components including: complexing agents, corrosion inhibitors (passivating agents), oxidizers, rheological modifiers (i.e.…”

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confidence: 99%

“…hard/soft) and pad composition/properties largely impacts the CMP performance, which has been attributed to the pad asperity contact and the different slurry transport profiles as many studies have investigated the effects of pad conditioning/surface roughness, flow rate, and the coefficient of friction. 9,10,[27][28][29][30][31][32][33] While there has been some indication that the pad type correlates to the chemical interactions at the Cu/slurry/pad interface, it is necessary to further examine and validate the effects of chemical entrapment within pad asperities as they relate to corrosion inhibition modes. Better understanding the mechanism of Cu surface passivation from a dual perspective (i.e.…”

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confidence: 99%

Synergistic Effect of Pad “Macroporous-Reactors” on Passivation Mechanisms to Modulate Cu Chemical Mechanical Planarization (CMP) Performance

Wortman-Otto

Graverson

Linhart

et al. 2020

ECS J. Solid State Sci. Technol.

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Decoupling the key interfacial mechanisms (chemical and mechanical) present during Cu CMP is critical to the development of slurry/pad consumable sets to reduce defectivity at advanced technology nodes. Understanding the Prestonian relationship, or lack thereof, can give rise to correlations between film density as a result of passivation film kinetics and thermodynamics as they relate to Cu oxidation/electrochemistry under dynamic conditions. The efficiency of film removability is strongly correlated to the molecular structure of the passivating agent and its synergistic relationship with the macroporous-reactor sites presented in this work. Results indicate that passivation film activation energy (Ea) is altered by the transport of fresh and waste slurry chemistry to the Cu interface via pad asperity contact. Furthermore, this work employs inhibitors with varying structural attributes to probe how the density of film formation is impacted by the efficiency of complexation and non-covalent interactions at the Cu surface. When comparing the best-in-class benzotriazole (BTA) with salicylhydroxamic acid (SHA), the triazole film formation is driven by a traditional complexation/π-stacking mechanism, while the hydroxamic acid film is the result of a colloidal supramolecular complex and soft surface-adsorption requiring reduced downforce for Cu removal.

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Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts

Ponte

Meyer

2016

Journal of Tribology

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Frictional behavior and topographical changes of material surfaces with applications in the microelectronics industry were experimentally observed. This work was performed to unveil trends in tribological characteristics of porous polyurethane material separately against copper and silicon dioxide materials typically found in integrated circuit (IC) polishing manufacturing processes. A linear reciprocating tribometer was utilized to translate the loaded contact of the polymer and contacting materials in the presence of a colloidal silica slurry. Contact forces were monitored throughout the experiments while surface topography of contacting surfaces was quantified using profilometry. Trials of polishing experiments were performed through a range of normal pressures and velocities to identify trends of interest, which are important in polishing. Coefficients of friction (COFs) between the polymer and contacting materials showed a decreasing trend with increasing polishing time and distance traveled. The copper and polymer material contacts were found to have a lower COF than that for the silicon dioxide and polymer contacts. Surface roughness of the polymer showed a general decreasing trend with increasing polishing time. This trend indicates a potential correlation between polymer surface roughness and the COF between the polymer and contacting materials. Evolution of the surface roughness of the materials differed depending on the direction along which topography was measured. An uncertainty analysis of the quantified parameters was conducted to provide knowledge in the confidence of the experimental results. Tribological behavior of the porous polyurethane and copper and silicon dioxide contacts is gathered from this experimental work for more complete characterization of the material.

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Energy dissipation and constitutive modeling for a mechanistic description of pad scratching in chemical–mechanical planarization

Cited by 3 publications

References 19 publications

Nonlinear Compression Behavior of the Grooved Polishing Pad: A Model and Its Validation

Nonlinear Compression Behavior of the Grooved Polishing Pad: A Model and Its Validation

Synergistic Effect of Pad “Macroporous-Reactors” on Passivation Mechanisms to Modulate Cu Chemical Mechanical Planarization (CMP) Performance

Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts

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