1983
DOI: 10.1016/0250-6874(83)85052-5
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Encapsulation of polymeric membrane-based ion-selective field effect transistors

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Cited by 52 publications
(14 citation statements)
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“…Perhaps the most important paper on this subject is the work of Ho et al who demonstrated that Kapton pressure sensitive tapes can be used for packaging (58). Dietz and Zemel demonstrated that polyimide layers can act as effective high 0 temperature silicon encapsulants for temperatures as high as 200 C (59).…”
Section: Integrated Silicon-based Electrochemical Sensorsmentioning
confidence: 99%
“…Perhaps the most important paper on this subject is the work of Ho et al who demonstrated that Kapton pressure sensitive tapes can be used for packaging (58). Dietz and Zemel demonstrated that polyimide layers can act as effective high 0 temperature silicon encapsulants for temperatures as high as 200 C (59).…”
Section: Integrated Silicon-based Electrochemical Sensorsmentioning
confidence: 99%
“…In most cases encapsulation is carried out by hand using epoxy resins, but it is impossible to produce ISFETs at low cost by this technique. Both photolithographic methods [159], [160] and an electrochemical method [161] have been proposed for the solution of this problem. One very promising development is the backside-contacted ISFET [162].…”
Section: Ceramic Humiditymentioning
confidence: 99%
“…• Maximum adhesion between the encapsulant and the sensor chip for minimizing moisture penetration. Glass [2], polyimide [3] and silicone [4] are amongst the encapsulation materials reported in the literature. Also, water resistant epoxies [5] are quite popular due to their ease of handling.…”
Section: Encapsulation Techniques and Materialsmentioning
confidence: 99%