Batch encapsulation technique for CMOS based chemical sensors

Prodromakis, Themis; Georgiou, Pantelis; Constandinou, Timothy G.; Michelakis, K.; Toumazou, C.

doi:10.1109/biocas.2008.4696939

Cited by 13 publications

(6 citation statements)

References 9 publications

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“…It is important to note that unlike SU-8 (the most commonly used negative photoresist), DABA can be easily photocured at any thickness without problems of bubbles or cracks. This is thanks to the fact that the prepolymer contains no solvents to be outgassed and the polymerization reaction does not need baking steps that can cause thermal stresses [10,19,20]. The result is a reliable packaging without cracks or adhesion failure which are typical causes of undesired leakage current between the solution and the chip electrical contacts.…”

Section: Resultsmentioning

confidence: 99%

Integration of microelectronic chips in microfluidic systems on printed circuit board

Burdallo

Jimenez-Jorquera

Fernández‐Sánchez

et al. 2012

J. Micromech. Microeng.

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A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 μm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 • C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields.

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Section: Resultsmentioning

confidence: 99%

Integration of microelectronic chips in microfluidic systems on printed circuit board

Burdallo

Jimenez-Jorquera

Fernández‐Sánchez

et al. 2012

J. Micromech. Microeng.

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“…For example, we fabricated a 3 µm-thick Parylene membrane, which was selectively plasma treated (400 W) for 35 min to obtain a membrane thickness of ~200 nm on top of the sensing sites (for consistency with the previous experiments), while preserving the thick layer (3 μm) of hydrophobic Parylene on top of the electrode tracks to provide high encapsulation quality. The sensor exhibits good sensitivity, while the measured leakage current remains in very low levels (9.8 nA for pH 4, 6.2 nA for pH 7, and 6.1 nA for pH 10), when compared against other encapsulants such as epoxies and SU-8 [22]. Previously attained experimental results on Si x N y and TiO 2 sensing membranes using the same evaluation methods employed in this work [12], demonstrated chemical sensitivities of 35 and 22 mV/pH respectively which are obviously improved comparing to Parylene; however, these sensing devices suffer from larger leakage currents.…”

Section: Selectively O 2 Plasma Treated Parylene Cmentioning

confidence: 97%

The dual role of Parylene C in chemical sensing: Acting as an encapsulant and as a sensing membrane for pH monitoring applications

Trantidou

Payne

Tsiligkiridis

et al. 2013

Sensors and Actuators B: Chemical

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“…PDMS is widely used as a building material for microfluidic structures and is bio-compatible and inert to most chemicals. Various types of epoxy have also been used to seal bond wires [ 101 , 105 , 125 , 126 , 127 ]. The epoxy was applied around the CMOS chip leaving the chip’s surface exposed.…”

Section: Cmos Biosensor Microsystem Integrationmentioning

confidence: 99%

CMOS Electrochemical Instrumentation for Biosensor Microsystems: A Review

Liu²,

et al. 2016

Sensors

142

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Modern biosensors play a critical role in healthcare and have a quickly growing commercial market. Compared to traditional optical-based sensing, electrochemical biosensors are attractive due to superior performance in response time, cost, complexity and potential for miniaturization. To address the shortcomings of traditional benchtop electrochemical instruments, in recent years, many complementary metal oxide semiconductor (CMOS) instrumentation circuits have been reported for electrochemical biosensors. This paper provides a review and analysis of CMOS electrochemical instrumentation circuits. First, important concepts in electrochemical sensing are presented from an instrumentation point of view. Then, electrochemical instrumentation circuits are organized into functional classes, and reported CMOS circuits are reviewed and analyzed to illuminate design options and performance tradeoffs. Finally, recent trends and challenges toward on-CMOS sensor integration that could enable highly miniaturized electrochemical biosensor microsystems are discussed. The information in the paper can guide next generation electrochemical sensor design.

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Batch encapsulation technique for CMOS based chemical sensors

Cited by 13 publications

References 9 publications

Integration of microelectronic chips in microfluidic systems on printed circuit board

Integration of microelectronic chips in microfluidic systems on printed circuit board

The dual role of Parylene C in chemical sensing: Acting as an encapsulant and as a sensing membrane for pH monitoring applications

CMOS Electrochemical Instrumentation for Biosensor Microsystems: A Review

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