2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) 2015
DOI: 10.1109/transducers.2015.7181302
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Encapsulation of integrated circuits in plastic microfluidic systems using hot embossing

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“…Lamination is especially suited for large-scale production of multilayer systems and has been utilized for the fabrication of different types of optical elements and devices. In addition to the encapsulation of optoelectronic devices such as organic light emitting diodes (OLED) 4 or integrated circuits in polymer packages, 5 lamination techniques were also used for high-throughput production of tactile sensors, 6 gigahertz waveguides, 7 and optical waveguides. 8 Current research in integrated optics and photonics focuses on the fabrication of embedded systems in thin polymer foils including waveguides as well as illumination and sensing elements.…”
Section: Introductionmentioning
confidence: 99%
“…Lamination is especially suited for large-scale production of multilayer systems and has been utilized for the fabrication of different types of optical elements and devices. In addition to the encapsulation of optoelectronic devices such as organic light emitting diodes (OLED) 4 or integrated circuits in polymer packages, 5 lamination techniques were also used for high-throughput production of tactile sensors, 6 gigahertz waveguides, 7 and optical waveguides. 8 Current research in integrated optics and photonics focuses on the fabrication of embedded systems in thin polymer foils including waveguides as well as illumination and sensing elements.…”
Section: Introductionmentioning
confidence: 99%