Encapsulants used in flip-chip packages

Suryanarayana, D.; Wu, T. Y.; Varcoe, J.A.

doi:10.1109/33.273685

Cited by 79 publications

(20 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The filling problem becomes even more serious as the chip size increases. Reference [8] has shown that the fill time is proportional to the square of the length of the chip. Such slow filling is detrimental to mass production.…”

mentioning

confidence: 99%

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Han

Wang

1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

140

View full text Add to dashboard Cite

In this paper, the flow of encapsulant during the underfill encapsulation of flip-chips has been studied. Analytical as well as numerical methods have been developed to analyze the flow. For capillary-driven encapsulation (by dispensing), the capillary force at the melt-front has been calculated based on a model for the melt-front shape. A model has also been developed for the analysis of forced-injection encapsulation. The numerical analysis uses a finite-element method based on a generalized Hele-Shaw method for solving the flow field.Experiments have been performed to investigate the flow behavior using actual chips and encapsulants. Short-shot runs have been performed to observe the melt-front advancement at different flow times. In addition, measurements have been made of the material properties of the encapsulant, namely its viscosity, curing kinetics and surface-tension coefficient. The experimental and simulation results have been compared in terms of the flow-front shapes and times at different fill fractions. Such comparisons indicate that the model developed in this study is adequate to approximately simulate the flow during encapsulation of flip chips.

show abstract

mentioning

confidence: 99%

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Han

Wang

1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

140

View full text Add to dashboard Cite

show abstract

“…Each component has a respective role and function. The most important function of the EMC was used as encapsulated, which is designed to protect electronic devices from the environmental factors such as gases, solvents and moisture [20]. EMC itself consists of other materials such as phenolic resins, epoxy resins, fused silica as filler, coupling agent, release agents and curing agent [21].…”

Section: Resultsmentioning

confidence: 99%

Gamma-irradiation effect on material properties behaviour of semiconductor package

Yusoff

Jalar²,

Othman³

et al. 2013

AIP Conference Proceedings

View full text Add to dashboard Cite

Current trends in digitization led to the application of an electronic package in many fields which are exposed to radioactive environment. Quad-Flat No-Lead (QFN) package technology is among the latest form of semiconductor package development in submicron size scale. A QFN package is designed by combining multimaterial and multitechnology. The ability to predict and eventually to prevent mechanical failures of microelectronics has becoming increasingly important in the development of semiconductor technology. Therefore, the relationship between the microstructure property behaviour of QFN semiconductor package and gamma irradiation has been investigated. The inhouse fabricated QFN was exposed to gamma radiation from a Cobalt-60 source with different doses varies from 0.5 Gy, and 50.0 kGy. Following, the packages were then subjected to Scanning Acoustic Microscope (CSAM) and X-ray Imaging System (3D X-ray) in order to identify internal discontinuity due to irradiation. In this investigation, the three point bending technique was used to obtain the flexural strength of the package. Irradiation packages have shown a decrease in their flexural strength with the increasing of gamma dose. In-depth analysis exhibited that the increment of exposure dose also influenced the occurrence of delamination between silicon die and copper leadframe. The cracks were also observed on the surface of the silicon die. The gamma irradiation is believed to play an important role towards the microstructure property behaviour of SDQFN package.

show abstract

“…Underfill, which is used to enhance the solder joint fatigue reliability of a flip chip device, is one of the key materials in flip chip technology. The introduction of underfill material between the die and substrate can greatly improve the solder joint fatigue life by mechanically coupling the substrate and die, and making the system stiffer [1], [2]. The underfill provides not only thermo-mechanical protection but also environmental protection to the flip-chip assembly.…”

Section: Introductionmentioning

confidence: 99%

Moisture Absorption in Uncured Underfill Materials

Luo

Wong

2004

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing agent. The influence of absorbed moisture on curing properties, thermomechanical property, and adhesion property of underfill after curing has been investigated. For epoxy cured with non-acid anhydride, the moisture absorption is low, and the absorbed moisture has no significant effect on the properties of cured underfill materials. For epoxy cured with acid anhydride, the moisture absorption before curing can be more than 2.0%, and the absorbed moisture can affect the properties significantly. The absorbed moisture can catalyze the curing reaction between acid anhydride and epoxy. The glass transition temperature of the cured samples is reduced after the underfill absorbs the moisture before curing. The adhesion strength decreases dramatically after the underfill absorbs the moisture before curing.

show abstract

Encapsulants used in flip-chip packages

Cited by 79 publications

References 10 publications

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Analysis of the flow of encapsulant during underfill encapsulation of flip-chips

Gamma-irradiation effect on material properties behaviour of semiconductor package

Moisture Absorption in Uncured Underfill Materials

Contact Info

Product

Resources

About