2017
DOI: 10.1016/j.microrel.2017.07.064
|View full text |Cite
|
Sign up to set email alerts
|

Enabling robust automotive electronic components in advanced CMOS nodes

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2019
2019
2022
2022

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 11 publications
0
1
0
Order By: Relevance
“…Thus, recent trends in technology node scaling and its effects on microelectronic reliability should be analyzed. nm [38] As indicated in the report from International Roadmap for Devices and Systems [39], the critical reliability issues for microelectronic devices in the near term (up to year 2024) are related to failures at the transistor-level. These issues include TDDB, BTI and HCI.…”
Section: Decrease In Devices' Operational Lifetime and Reliability Wimentioning
confidence: 99%
“…Thus, recent trends in technology node scaling and its effects on microelectronic reliability should be analyzed. nm [38] As indicated in the report from International Roadmap for Devices and Systems [39], the critical reliability issues for microelectronic devices in the near term (up to year 2024) are related to failures at the transistor-level. These issues include TDDB, BTI and HCI.…”
Section: Decrease In Devices' Operational Lifetime and Reliability Wimentioning
confidence: 99%