Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

Rudolph, Catharina; Hanisch, Anke; Voigtlander, M.; Gansauer, P.; Wachsmuth, Holger; Kuttler, Simon; Wittler, Olaf; Werner, Thomas R.; Panchenko, Iuliana; Wolf, Marcus

doi:10.1109/ectc32696.2021.00018

Cited by 15 publications

(4 citation statements)

References 4 publications

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“…For a successful hybrid bonding, the chemical-mechanical polishing (CMP) processing of the Cu/ dielectric plays a critical role where the surface roughness, uniformity and dishing depth can be influenced. Moreover, the annealing process parameters can highly impact the Cu-Cu bonding yield [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Cu Pumping Analysis during Cu/SiO2 Hybrid Bonding using In-situ SPM Imaging

Roshanghias,

Kaczynski,

Hangen

2024

IMAPSource Proceedings

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The assessment of Cu pumping (also known as Cu extrusion) during thermal annealing is vital information for the successful execution of hybrid bonding as well as defect-free processing of the through silicon vias (TSV). Unpredicted Cu pumping can pose major reliability issues. Correspondingly, in this study, high-temperature analysis of Cu pumping was conducted utilizing in-situ scanning probe microscopic (SPM) imaging. Cu/SiO2 surfaces with recessed and protruded Cu topographies were produced by chemical mechanical polishing (CMP) and used for Cu pumping investigations. The amount of Cu pumping upon thermal annealing up to 400°C and cooling down to room temperature was precisely quantified. The SPM results were compared with FEM simulation results, and a numerical equation for Cu pumping was proposed, accordingly. It was shown that by using in-Situ SMP imaging, valuable information on the behavior of hybrid Cu/dielectric surfaces can be generated.

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Section: Introductionmentioning

confidence: 99%

Cu Pumping Analysis during Cu/SiO2 Hybrid Bonding using In-situ SPM Imaging

Roshanghias,

Kaczynski,

Hangen

2024

IMAPSource Proceedings

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“…Since chip manufacturing technology has been a vital role in technological and scientific innovations, semiconductor industry and equipment attract more attention 1–5 . Immersion lithography technology 6 replaces air with water between the objective and wafer to improve imaging resolution, as shown in Figure 1a.…”

Section: Introductionmentioning

confidence: 99%

The influence of mold design and process parameters on dimensional shrinkage of perfluoroalkoxy alkane injection molding parts

Li,

Liu,

Zhang

et al. 2024

J of Applied Polymer Sci

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In mass production, injection molding plays a vital role in manufacturing various parts with complex settings. As perfluoroalkoxy alkane (PFA) injection‐molded products are widely used in immersion system, dimensional quality needs more attention. However, there is limited research on the dimension defects of PFA injection‐molded products. This study focused on the influence of mold design and process parameters on PFA part shrinkage, using mold flow simulation and orthogonal testing separately. Several gate locations and sizes were simulated to minimize shrinkage in mold design. Displacements varied with gate locations, and shrinkage decreased with larger gate sizes. The Taguchi method analyzed process parameters' impact on shrinkage. The results indicated that the injection rate had the most significant effect on the shrinkage of tube length, while melt temperature, holding pressure, and screw speed affected the shrinkage of tubes' outside diameter. Different flow directions exhibited variance in shrinkage. Using max–min normalization, the two shrinkage values reached 0.00972, whereas the smallest value obtained in the orthogonal experiment was 0.1545 in run 3. Thus, optimizing mold design and process parameters were two effective methods to reduce shrinkage. This study reduced shrinkage and improved the quality of PFA injection molding parts for semiconductor systems.

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“…Different combinations of dicing techniques and cleaning concepts are suggested to increase the process yield. Blade dicing and stealth dicing often induce large amounts of particles [9], which can be mitigated by protection layers and process optimization [10] [11]. Other papers propose cleaner singulation techniques like laser and plasma dicing as well as combined approaches [12].…”

mentioning

confidence: 99%

Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding

Bex,

Phommahaxay,

Kennes

et al. 2024

IMAPSource Proceedings

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Hybrid Cu/dielectric bonding is a well-established technology for Wafer-To-Wafer (W2W) bonding, but it is challenging to apply this technology to Die-To-Wafer (D2W) bonding. Very small particles on the die or wafer can lead to voids/non-bonded regions. Processes to clean and activate wafers for hybrid W2W are quite mature, but it is very challenging to apply these to thinned and singulated dies for D2W bonding. To allow a (partial) re-use of the existing wafer level cleaning, metrology and activation processes and equipment, we propose a new concept where dies are being singulated, cleaned and activated on a glass carrier wafer. After the die preparation steps, the dies are directly picked from the carrier wafer. This approach does not involve additional pick & place steps and avoids the use of conventional dicing tapes. The first direct dielectric D2W bonding experiments using this new approach show a very promising bonding yield, with a high number of completely void-free bonded 50 μm thin dies. Additionally, by eliminating dicing tapes, thinned wafers and singulated dies are always supported by a rigid surface, enabling ultrathin die handling. In this study we also report the handling of dies down 10 μm thickness.

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Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

Cited by 15 publications

References 4 publications

Cu Pumping Analysis during Cu/SiO2 Hybrid Bonding using In-situ SPM Imaging

Cu Pumping Analysis during Cu/SiO2 Hybrid Bonding using In-situ SPM Imaging

The influence of mold design and process parameters on dimensional shrinkage of perfluoroalkoxy alkane injection molding parts

Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding

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