2023
DOI: 10.1016/j.addma.2023.103717
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Enabling 3D multilayer electronics through the hybrid of vat photopolymerization and laser-activated selective metallization

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Cited by 3 publications
(3 citation statements)
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“…Using DLP and ELP procedures to deposit metal layers on the micro-lattice, Shin et al increased the lattice’s compressive rigidity from 8.8 MPa to 11.1 MPa [ 103 ]. To fabricate high-resolution 3D conformal/embedded circuit boards, sensors, antennas, etc., Liu et al integrated laser-activated ELP with a variety of AM technologies [ 104 , 105 , 106 , 107 , 108 ].…”
Section: Embedded Sensors With 3d Printing Technologymentioning
confidence: 99%
“…Using DLP and ELP procedures to deposit metal layers on the micro-lattice, Shin et al increased the lattice’s compressive rigidity from 8.8 MPa to 11.1 MPa [ 103 ]. To fabricate high-resolution 3D conformal/embedded circuit boards, sensors, antennas, etc., Liu et al integrated laser-activated ELP with a variety of AM technologies [ 104 , 105 , 106 , 107 , 108 ].…”
Section: Embedded Sensors With 3d Printing Technologymentioning
confidence: 99%
“…Our group combined laser activated ELP with various AM technologies for the fabrication of high-resolution 3D conformal/embedded circuit boards, sensors, antennas, etc. [ 31 , 32 , 33 , 34 , 35 ].…”
Section: Introductionmentioning
confidence: 99%
“…Our group proposed a series of HAM technology experiments based on laser activated electroless plating for the fabrication of 3D conformal/multilayer electronics, sensors, antennas, etc. [21][22][23][24][25].…”
Section: Introductionmentioning
confidence: 99%