Empty Substrate‐Integrated Waveguides: A Low‐Cost and Low‐Profile Alternative for High‐Performance Microwave Devices

Belenguer, Ángel; Esteban, H.; Borja, Alejandro L.; Ballesteros, José A.; Fernández, Marcos D.; Morro, J.V.; Dios, Juan J. de; Bachiller, C.; Boria, Vicente E.

doi:10.1002/047134608x.w8411

Cited by 6 publications

(5 citation statements)

References 92 publications

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“…To test the good performance of the ESIW, many different devices (filters, antennas, directional couplers, phase-shifters, etc.) have been properly designed and manufactured, and several transitions to connect the ESIW to microstrip lines have also been proposed [3].…”

Section: Introductionmentioning

confidence: 99%

Through-Wire Microstrip-to-Empty-Substrate-Integrated-Waveguide Transition at Ka-Band

Ballesteros,

Belenguer,

Fernandez

et al. 2023

Applied Sciences

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The advantages of the Substrate-Integrated Waveguide (SIW) in terms of low profile, integration with Printed Circuit Board (PCB) and low cost are maintained by the Empty Substrate-Integrated Waveguide (ESIW). Moreover, as the dielectric fill is avoided, other advantages are also added: resonators with higher quality factor and lower insertion losses. Since 2014, when it was proposed, several devices for X-band to Ka-band applications have been accurately designed and manufactured. In this way, transitions are one of the most important components, as they allow the connection between the ESIW and other planar transmision lines such as microstrip. To accomplish this aim, different transitions have been proposed in the literature: based on sharp dielectric tapers combining metallized and non-metallized parts, which increases the manufacture complexity; with a broadened ESIW section, that is less complex at the cost of increasing reflection and radiation losses due to the abrupt discontinuity; based on tapered artificial dielectric slab matrix, more difficult to mechanize; using a tapered microstrip transition, with high radiation losses; and even transitions for multilayer devices. Among all the transitions, the most versatile one is the through-wire transition, as microstrip and ESIW can be implemented in different layers and allows any feeding angle between the microstrip line and the ESIW. In this paper the through-wire transition has been properly validated at Ku- and Ka-bands. Moreover, a back-to-back transition has been accurately manufactured in Ka-band with measured insertion losses lower than 3.7 dB and return losses higher that 11.7 dB, concluding that the transition is not frequency dependent.

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Section: Introductionmentioning

confidence: 99%

Through-Wire Microstrip-to-Empty-Substrate-Integrated-Waveguide Transition at Ka-Band

Ballesteros,

Belenguer,

Fernandez

et al. 2023

Applied Sciences

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“…lower losses and higher quality factor in resonators. Many different devices, such as filters, antennas, directional couplers or phase-shifters, among others, have been implemented in ESIW technology [3].…”

Section: Introductionmentioning

confidence: 99%

Improved Microstrip-to-ESIW Transition With Elliptical Dielectric Taper in Ku- and Ka-Bands

et al. 2022

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Empty Substrate Integrated Waveguide (ESIW) technology preserves the many advantages of the Substrate Integrated Waveguide (SIW) such as low cost, low profile, and easy integration with Printed Circuit Boards (PCBs). Moreover, it has additional advantages due to the avoidance of dielectric filling: lower insertion losses and resonators with higher quality factor. In order to connect the ESIW line to classical planar lines, the design of transitions becomes specially important. Due to this, some microstrip-to-ESIW transitions have been published in recent years. Problems of these transitions are usually the complexity of the manufacturing process or increased radiation losses. Knowing the aforementioned disadvantages of the published solutions, in this paper, the transition with an expanded ESIW section has been improved, by adding an easy-to-manufacture dielectric taper that minimizes the undesired radiation losses. Additionally, the new proposed transition can be mechanized easier than previous solutions based on sharp tapers. Moreover, the slight overlap between the microstrip line and the upper ESIW metal cover has been avoided, thus enhancing the return losses of the proposed transition. To validate the proposed transition, two backto-back prototypes have been manufactured both in Ku-and Ka-band, obtaining insertion losses lower than 0.31 dB and return losses higher than 20.8 dB in Ku-band, and insertion losses lower than 1.36 dB and return losses higher than 14.75 dB in Ka-band.INDEX TERMS Empty Substrate Integrated Waveguide (ESIW), microstrip, transition, elliptical taper, millimeter-waves systems, Ku-band, Ka-band.

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“…This good performance can be achieved, essentially, due to the absence of dielectric, which reduces the degradation of electromagnetic waves and allows operation at a very high frequency without severe deterioration. Nevertheless, difficult manufacturing processes, high cost or difficult integration with other planar systems are inherent problems to topologies based on coaxial lines [1].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, ESICL is a pure TEM line (not quasi-TEM like microstrip or SISL), which is also an important advantage. Devices implemented in ESICL, like filters [10,11], inverters [12], power dividers or directional couplers [13], can be manufactured quite easily and would achieve very high-quality responses and low losses, with performance much better than devices integrated in conventional planar lines or substrate integrated circuits (SICs), such as substrate integrated waveguide (SIW) [1], and only comparable to other completely emptied integrated waveguides, which is the case of the empty substrate integrated waveguide (ESIW) [1].…”

Section: Introductionmentioning

confidence: 99%

Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021

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Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

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Empty Substrate‐Integrated Waveguides: A Low‐Cost and Low‐Profile Alternative for High‐Performance Microwave Devices

Cited by 6 publications

References 92 publications

Through-Wire Microstrip-to-Empty-Substrate-Integrated-Waveguide Transition at Ka-Band

Through-Wire Microstrip-to-Empty-Substrate-Integrated-Waveguide Transition at Ka-Band

Improved Microstrip-to-ESIW Transition With Elliptical Dielectric Taper in Ku- and Ka-Bands

Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

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