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This letter shows the procedure of design of a hybrid directional coupler based on Empty Substrate Integrated Waveguide (ESIW). Once proved in previous works the feasibility of ESIW and the good performance indexes this technology can achieve, the following step is designing useful devices to be integrated in planar circuits. The proposed hybrid coupler, which is the first ESIW 4-port available circuit, is designed at 15 GHz with 3-dB coupling factor and a minimum of 20 dB of isolation over 30% bandwidth. After manufacturing the circuit, simulated and measured results are presented and discussed.

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Empty Substrate Integrated Waveguide has recently received special attention due to the fact that by removing the dielectric, this technology not only maintains the advantages of Substrate Integrated Waveguide circuits, but also improves their behaviour. Many circuits have been designed for Empty Substrate Integrated Waveguide, with several filters of different performance among them. The next challenge is to achieve the maximum possible compactness degree for these circuits. In this paper, we present the design of a multilayer Empty Substrate Integrated filter with the same performance as if it were manufactured in a single layer, but significantly increasing its compactness and mechanical resistance.

Empty substrate integrated waveguide (ESIW) devices can provide high quality and completely integrated devices, but they are usually larger than the same ones implemented with alternative technologies. One of the most extended strategies to compact electronic devices is the use of multilayer technology. Nevertheless, to perform multilayer devices in ESIW, a versatile and efficient transition between the guides in different layers is needed. Currently, only one multilayer device is known in this ESIW technology, which is a transition between a pair of guides built in contiguous layers that requires complex and nonstandard 3-D manufacturing processes. In this letter, a multilayer transition to connect a pair of guides separated by an arbitrary number of layers is successfully designed and experimentally validated without 3-D manufacturing processes. This novel and versatile transition opens the way to further develop multilayer compact devices in the ESIW technology such as compact filters.