On-Chip Communication Architectures 2008
DOI: 10.1016/b978-0-12-373892-9.00013-x
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Emerging On-Chip Interconnect Technologies

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Cited by 7 publications
(6 citation statements)
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“…In order to make the AM machine an independent and complete system, we present the inference process as an embedded design. The BNN is implemented in the system on a chip (SoC) [ 30 ], which is the Terasic SoC kit development board as shown in Figure 2 . This board contains an FPGA embedded with an ARM processor, as well as other components such as memory, connectors, sensors, and display.…”
Section: Research Methodsmentioning
confidence: 99%
“…In order to make the AM machine an independent and complete system, we present the inference process as an embedded design. The BNN is implemented in the system on a chip (SoC) [ 30 ], which is the Terasic SoC kit development board as shown in Figure 2 . This board contains an FPGA embedded with an ARM processor, as well as other components such as memory, connectors, sensors, and display.…”
Section: Research Methodsmentioning
confidence: 99%
“…Each interconnection type Type Link ∈ Types Link has additional characteristics like the transmission energy consumption E transmission : Type Link → N or the transmission delay δ transmission : Type Link → N . Referring back to the design of a multiprocessor system, our concept can model well-known communication structures in System-on-Chip (SoC) design like bus-based communication and Network-on-Chips (NoCs) [34]. On the one hand, for a bus-based communication, we can assign a respective communication type with properties that specify the maximum number of connected devices and the blocking connection arising for the bus-based structure, whereas the respective interconnection types can model the access times and transmission cost for messages.…”
Section: System Modelmentioning
confidence: 99%
“…Additionally, the temporary registers implanted in shared buses usually consume a greater area and higher energy levels, resulting in poor scalability. This is likely to stand as a major hindrance to the maintenance of effective communication via future Multi-Processor Systems on Chip (MPSoC) designs [24][25][26][27][28]. To cater to these needs, Multistage Interconnection Networks (MINs) have emerged as a potential solution for the increasing demand for scalability and reliability in static Network-on-chip (NoC) architectures, to meet the exponential growth in massive parallel computing.…”
Section: Related Workmentioning
confidence: 99%