Commercializing a highly efficient passivated-emitter-and-rear-cell solar cell requires high passivation quality and stability of the cell's Al 2 O 3 layer. This paper reports on light-induced degradation (LID) of the Al 2 O 3 layer and the effects of post-annealing temperatures after light soaking on the passivation quality. To understand the LID phenomenon of the Al 2 O 3 passivation layer, we used a Ga-doped Si wafer that prevented boron-oxygen LID effects. The fabrication process was carried out on large-area (156 × 156 mm 2 ), commercially available, (100)-oriented Ga-doped Czochralski(Cz) Si wafers in the pilot line. Before and after light soaking, the effective lifetime was measured using Sinton's quasi-steady-state photoconductance as a function of annealing temperature. Chemical binding structures near the interface of the Al 2 O 3 film and Si wafer were investigated using X-ray photoelectron spectroscopy (XPS). The passivation quality and light-induced degradation showed the best performance at an annealing temperature of 600 • C. Analysis of XPS data revealed that the chemical binding structures at the interface of the Al 2 O 3 layer and Si wafer were stabilized by optimizing the annealing condition of the Al 2 O 3 layer. By optimizing an industrially feasible Al 2 O 3 passivation process, an efficiency of 20.1% was achieved on large-area, commercial-grade Cz c-Si wafers.