Electrothermal co-simulation of a two-chip power delivery network in frequency domain

Li, Na; Mao, Jun‐Fa; Zhao, Wensheng; Tang, Min; Wang, Yin

doi:10.1109/edaps.2017.8277000

Cited by 1 publication

(1 citation statement)

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“…The numerical method takes the Maxwell equations and heat conduction equations as the governing equations, and the two are coupled through the temperature dependence of power losses and material parameters. Li developed an FEM-based solver to investigate the electrothermal characteristics of a two-chip power delivery network (PDN) structure, circularly solving the wave equation for a full-wave electromagnetic analysis and the heat conduction function for the thermal analysis [56]. He developed a 3D integrated chip flow heat transfer model under the action of electrothermal coupling and proposed a full-wave electromagnetic simulation model of the signal interconnect components with the same structural parameters; a coupled analysis of electrothermal effects and fluid heat transfer models was achieved by COMSOL Multiphysics [57].…”

Section: Electro-magnetic Couplingmentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Electro-magnetic Couplingmentioning

confidence: 99%