2006
DOI: 10.1016/j.surfcoat.2005.11.120
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Electrostatic spray deposition (ESD) of polymeric powders on thermoplastic (PA66) substrate

Abstract: This paper deals with a primerless electrostatic spray deposition process (ESD) for coating thermoplastic (PA66) substrates using epoxypolyester, metallic epoxy-polyester, and epoxy powder paint. A novel and never before used pretreatment system, based on a low speed cold spray of fine copper powders, applied a thin conductive film on the plastic substrate, which made the ESD possible.The focus of first part of the paper is on analyzing the influence of both electrical and aerodynamic process parameters on ESD… Show more

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Cited by 34 publications
(20 citation statements)
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“…Nevertheless, in employing progressively smaller abrasive size, the average size of splinters embedded in the surface decreased, and consequently, the result has a more aesthetically pleasing appearance. Similar results were found in previous studies of fluidized bed machining, which found widespread embedding phenomena of harder abrasive splinters in the softer substrates are recurrent phenomena (alumina splinters in aluminium and brass substrates [32,33], copper splinters in polyamide 6 and 66 substrates [34]). Fig.…”
Section: Analysis Of Surface Morphologysupporting
confidence: 91%
“…Nevertheless, in employing progressively smaller abrasive size, the average size of splinters embedded in the surface decreased, and consequently, the result has a more aesthetically pleasing appearance. Similar results were found in previous studies of fluidized bed machining, which found widespread embedding phenomena of harder abrasive splinters in the softer substrates are recurrent phenomena (alumina splinters in aluminium and brass substrates [32,33], copper splinters in polyamide 6 and 66 substrates [34]). Fig.…”
Section: Analysis Of Surface Morphologysupporting
confidence: 91%
“…W literaturze światowej można znaleźć informacje o udanym natryskiwaniu powłok metalowych na tworzywa, m.in. cyny na PC/ABS, polipropylen, polistyren i poliamid-6 [4]; miedzi na PA66 [5], a także aluminium na PEEK450CA30 [6]. Uzyskane powłoki były gęste o małej porowatości.…”
Section: Stan Zagadnieniaunclassified
“…Przy zastosowaniu ciśnienia 3 mPa bez podgrzania i tym samym podwyższeniu prędkości czą-steczek obserwowano głównie erozję substratu [4]. W pracy [5] odnotowano jednak, że po uzyskaniu pierwszej szczelnej powłoki miedzi nie następuje dalsze osadzanie, co jest spowodowane zmianą rodzaju podłoża na metalowe a tym samym potrzebę zastosowania wyższych prędkości. W przypadku cyny udało się uzyskać szczelną powłokę o grubości 45÷100 μm przy zastosowaniu azotu o ciśnieniu 3 mPa bez podgrzania i przy obliczonej prędkości cząsteczek 310 m/s.…”
Section: Stan Zagadnieniaunclassified
“…Microfluidic devices were fabricated by MIT own built hot-embossing setup using uncoated and coated micromold (Barletta et al 2006). Hot-embossing process is described elsewhere (Saha et al 2010a, b).…”
Section: Characterizationmentioning
confidence: 99%