Electrostatic discharge (ESD)—Facts and faults—A review

Trost, Thomas

doi:10.1002/pts.2770080502

Cited by 8 publications

(2 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is resulting damages under the logistic chain [17]. According to some sources the rudimentary ESD protections problems take the 5 % of the whole market sales in the USA [18].…”

Section: A Importance Of Esd Protectionmentioning

confidence: 99%

Investigation of an Electrostatic Discharge Protective Biodegradable Packaging Foam in the Logistic Chain

Mojzes

Tóth

Csavajda

2014

Logistics &Amp; Sustainable Transport

View full text Add to dashboard Cite

Since the beginning of the 20th century, logistics has undergone a huge technological development, which has, however, resulted in many negative effects as well. The industry, particularly in the packaging industry has been a massive waste producer, although recently it has forced the use of new materials and it started to focus on environmentally friendly technologies. During the transportation of finished and semi-finished Electrostatic Discharge (ESD) sensitive products, the product packaging system has a vital role. These kind of packaging materials must be suitable to both logistic (protection against mechanical and environmental stresses) and special ESD protection requirements. During the transportation of printed-circuit electronic products, ESD defense is then of primary significance. However there is a huge disadvantage for the use of various shield bags. Namely, this kind of associated packaging is particularly pollutant, it causes a lot of inconvenience in the form of waste. In order to rule out these materials from the packaging system, new innovative solutions have to be found. The investigated TPS (thermoplastic starch biodegradable foam) is subjected to a validation, a long process to certify that this material unites properties of two types of packaging materials at the same time. On the one hand, this packaging foam has to meet the requirements product defense. On the other hand, the material must be anti-static under the logistic stress effects. In case it is found suitable, it can be an alternative of the conventional materials. In this article, we investigate the ESD characteristic of TPS foam. As this material sensitive for environmental parameters during transportation, we make the relevant Surface Resistance (Rs) tests on different temperature and humidity conditions. Based on result, the decision of the application can be done, as an ESD packaging material.

show abstract

“…It is resulting damages under the logistic chain [17]. According to some sources the rudimentary ESD protections problems take the 5 % of the whole market sales in the USA [18].…”

Section: A Importance Of Esd Protectionmentioning

confidence: 99%

Investigation of an Electrostatic Discharge Protective Biodegradable Packaging Foam in the Logistic Chain

Mojzes

Tóth

Csavajda

2014

Logistics &Amp; Sustainable Transport

View full text Add to dashboard Cite

show abstract

“…Their derived packaging materials can easily accumulate static charge during manufacturing, assembling, storage, and service. The electrostatic discharge (ESD) of the packaging materials often causes damage to the electronic components stored inside, with annual losses estimated in billions of dollars 1–3. Therefore, the electronic industry association (EIA) and the electrostatic discharge association (ESDA) have established international standards demanding ESD protection for sensitive electronic devices 4.…”

Section: Introductionmentioning

confidence: 99%

Processing‐dependent high impact polystyrene/styrene‐butadiene‐styrene tri‐block copolymer/carbon black antistatic composites

Tang

Liu

et al. 2011

J of Applied Polymer Sci

View full text Add to dashboard Cite

ABSTRACT:The electrical resistivity and morphology of high impact polystyrene (HIPS)/styrene-butadiene-styrene triblock copolymer (SBS)/carbon black (CB) blends were studied. Their antistatic sheets were prepared by both compression-molding and extrusion calendaring process, with their surface morphology observed using scanning electron microscopy (SEM). The SEM images reveal better dispersion of CB achieved in extrusion-calendering, resulting in low percolation threshold values in HIPS composites. Higher compression ratio and higher drawing speed (corresponding lower sheet thickness) are beneficial to get better CB dispersion, leading to decreased conductivity for the antistatic sheets. SEM images indicate that strong shear forces in extrusion tend to break the conductive network of CB, resulting in increased surface resistivity.

show abstract

Antistatic agents

Pritchard¹

1998

Plastics Additives

View full text Add to dashboard Cite

Electrostatic discharge (ESD)—Facts and faults—A review

Cited by 8 publications

References 1 publication

Investigation of an Electrostatic Discharge Protective Biodegradable Packaging Foam in the Logistic Chain

Investigation of an Electrostatic Discharge Protective Biodegradable Packaging Foam in the Logistic Chain

Processing‐dependent high impact polystyrene/styrene‐butadiene‐styrene tri‐block copolymer/carbon black antistatic composites

Antistatic agents

Contact Info

Product

Resources

About