Electrooptic sensor module fabrication for near-field intrabody communication

Abstract

In this paper, we describe how to obtain a low cost electrooptic (EO) sensor module for the mass production of nearfield intrabody communication devices. In our previous study, we used a bulk cleavage technique to fabricate EO modulators without the need for any optical polishing or washing processes. In this study, we fabricated EO modulators as a miniaturized chip sensor without a base portion, and clarified the feasibility of assembling optical components by only a passive alignment technique with a compact housing. #

Method for systematically designing polarization optics to maximize sensitivity of electrooptic sensors

“…1. 1,4,[10][11][12][13]16,[31][32][33][34][35][36] Since the probe light emitted from a laser propagates in one direction, let's call the optics a "one-way configuration". The x-z plane corresponds to a horizontal plane.…”

“…Applications that utilized the isolation nature of fiber cables were proposed. Examples of such applications include the characterization of microwave antennas and devices, [25][26][27][28][29][30] the evaluation of channels 31,32) and transceivers [33][34][35] for novel wireless systems, and the measurement of electrocardiograms. 36) The other advantage of EO sensors is that they can detect electric fields without antennas.…”

Magnetooptical and crystalline properties of sputtered garnet ferrite film on spinel ferrite buffer layer

“…The condition of the interface, which functions as an initial buffer layer between the garnet film and the substrate, affects the magnetooptical characteristics of the entire film. [36][37][38][39] Moreover, when a garnet film is thin, the annealing-induced crystallization is insufficient. 39) This has made it difficult to obtain a thin film that has both a large Faraday rotation angle and a large coercive force.…”

Magnetooptical and crystalline properties of sputtered garnet ferrite film using a stress relaxation buffer layer

“…However, thermal distortion is a problem with this method because cracks easily occur in the film, which are generated by the difference between the thermal expansion coefficients (ΔTECs) of the garnet film and the glass substrate. Various attempts have been made to suppress crack formation, such as by matching the TECs of the substrate and the garnet film, by adding a layer with a different TEC as a buffer layer, [24][25][26][27] or by using a patterning approach. 28,29) However, it has been very difficult to suppress crack formation over a film with a large surface area.…”