Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Garimella, Suresh V.; Persoons, Tim; Weibel, Justin A.; Gektin, Vadim

doi:10.1109/tcpmt.2016.2603600

Cited by 136 publications

(52 citation statements)

References 80 publications

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“…2(b), is given by (1). C, G, T, and P matrices in (1) indicate the thermal capacitance, thermal conductance, temperature difference between nodes, and heat source power, as shown in (2), (3), (4), and (5), respectively.…”

Section: Adaptive Thermal Property Controlmentioning

confidence: 99%

“…Fully utilizing the thermal budget of the junction and skin simultaneously is challenging, because the thermal behavior and tolerable temperature ranges are different between the junction and skin [1]. In terms of the tolerable temperature range, the allowed maximum junction temperature is approximately 85°C, considering reliability stress, and the skin temperature limit ranges between 40°C and 45°C for comfortable use [1,2,3]. The typical thermal response time of the junction temperature is a few microseconds, whereas that of the skin temperature is up to a minute [1].…”

Section: Introductionmentioning

confidence: 99%

“…In terms of the tolerable temperature range, the allowed maximum junction temperature is approximately 85°C, considering reliability stress, and the skin temperature limit ranges between 40°C and 45°C for comfortable use [1,2,3]. The typical thermal response time of the junction temperature is a few microseconds, whereas that of the skin temperature is up to a minute [1]. For these reasons, the thermally critical region varies with the power consumption level of the application processor (AP), which is the dominant heat source of the mobile device [4].…”

Section: Introductionmentioning

confidence: 99%

“…Conventional thermal management strategies cannot cope with the thermal budget unbalancing, because the thermal properties such as thermal conductivity, heat capacity, and density in the system are handled as fixed factors [1,5]. We present an adaptive thermal property control (ATPC) technique that can utilize the thermal properties between the junction and skin adaptively, according to the varying thermal margins for junction and skin during AP operation.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Adaptive thermal property control technique for holistic thermal management of mobile devices

Lee

Huh

et al. 2018

IEICE Electron. Express

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From the perspective of user experience and safety when using mobile devices, skin (outer surface) temperature-aware thermal management, along with the application processor die-junction temperature, is crucial. Traditional thermal management techniques have ignored the combined effect of the junction and skin temperatures, resulting in unnecessary performance degradation due to excessive thermal throttling. We propose a novel thermal management method for mobile devices, by incorporating an adaptive thermal property control (ATPC) technique. The ATPC technique is designed to adapt the thermal properties between the junction and skin according to their thermal margins. Intensive simulation results show that the ATPC technique prolongs the maximum performance duration of the mobile device up to 34 min in the nominal application processor power consumption range of 2.9-4.6 W. In other words, the technique provides a performance gain of approximately 7% by preventing false early thermal throttling.

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Section: Adaptive Thermal Property Controlmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Adaptive thermal property control technique for holistic thermal management of mobile devices

Lee

Huh

et al. 2018

IEICE Electron. Express

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show abstract

“…[1,2] Common techniques for fabricating these devices include molding, hot extrusion, and CNC. [1,2] Common techniques for fabricating these devices include molding, hot extrusion, and CNC.…”

Section: Introductionmentioning

confidence: 99%

Recent Advances on 3D Printing Technique for Thermal‐Related Applications

et al. 2018

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Advances in ink formulation and printing techniques make producing material systems with new and versatile characteristics and functionalities possible. Additive manufacturing or 3D printing enables fabricating complex structures at a faster production rate using different types of materials for various applications. Recently, 3D printing methods are being studied for thermal‐related applications. In this paper, the authors review recent progress of materials and printing techniques for thermal application devices using composite materials.

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Laser‐Tuned Surface Wettability Modification and Incorporation of Aluminum Nitride (AlN) Ceramics in Thermal Management Devices

Mukhopadhyay,

Pal,

Sarkar

et al. 2024

Adv Funct Materials

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Aluminum nitride (AlN), a versatile ceramic with high thermal conductivity, high electrical resistivity, and a coefficient of thermal expansion compatible with silicon, is well‐suited for direct‐to‐chip cooling applications of electronics, implementation in wide bandgap semiconductors, and for high‐temperature heat exchangers. Despite multiple advantages, AlN's implementation in liquid‐cooling applications is often hindered by surface‐degrading effects of working‐fluid‐induced hydrolysis. Herein, a scalable ‐but highly tunable‐ wettability engineering approach is introduced, that allows effective implementation of bulk AlN substrates in enhanced two‐phase cooling of electronics. The approach prevents hydrolysis of AlN by aqueous media and establishes control over surface roughness, all the while maintaining bulk integrity and material properties of the underlying substrate. Demonstration of the new approach is presented in spontaneous, pumpless, surface liquid transport, a necessity if such ceramics are to play an integral role as components of sealed, phase‐change, wickless thermal‐management devices (e.g., vapor chambers or heat pipes) that require rapid working‐fluid transport in their multi‐phase interior. The novelty of this work lies in establishing a scalable methodology for utilizing and further enhancing the properties of this non‐oxide ceramic material for phase‐change heat‐transfer hermetic devices, thereby paving the way toward the implementation of this intriguing material in next‐generation heat spreaders.

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Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Cited by 136 publications

References 80 publications

Adaptive thermal property control technique for holistic thermal management of mobile devices

Adaptive thermal property control technique for holistic thermal management of mobile devices

Recent Advances on 3D Printing Technique for Thermal‐Related Applications

Laser‐Tuned Surface Wettability Modification and Incorporation of Aluminum Nitride (AlN) Ceramics in Thermal Management Devices

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