Electronics for Ultrasonic Imaging System

Svilainis, Linas; Dumbrava, V.; Kitov, S.; Aleksandrovas, Arturas; Tervydis, P.; Liaukonis, Dobilas

doi:10.5755/j01.eee.20.7.8024

Cited by 15 publications

(22 citation statements)

References 20 publications

(25 reference statements)

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“…Attenuation was measured using toneburst signals and sine wave correlation (SWC) technique [12]. Sine and cosine function are fitted to the sampled signal s 1 …s M : were M is samples number, f s is sampling frequency and t 1 …t M are sampling time instances.…”

Section: B Attenuation Measurementmentioning

confidence: 99%

“…Excitation was performed using a unipolar pulser, capable of rectangular pulses production [12]. Two 2 MHz center frequency ultrasonic transducers TF2C6N from Dopler Inc. were used.…”

Section: A Experimental Setupmentioning

confidence: 99%

“…Transducers were placed against each other at 5 mm distance. Registration was carried out using two channels, 10 bit ADC 100 Ms/s sampling rate ultrasonic data acquisition system [12]. Both ultrasonic pulser output and received signals were recorded using toneburst excitation ( Fig.…”

Section: A Experimental Setupmentioning

confidence: 99%

See 2 more Smart Citations

Epoxy cure monitoring using ultrasonic spread spectrum binary signals

Liaukonis

Aleksandrovas

Svilainis

2014

2014 IEEE 2nd Workshop on Advances in Information, Electronic and Electrical Engineering (AIEEE)

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Procedure for dual component epoxy cure monitoring is presented. Accurate time of flight estimation was used employing the correlation processing. Several spread spectrum signals have been put in comparison with conventional pulse and toneburst signals. Experimental results presented indicate that reliable separation of curing phases can be established using both ultrasound velocity and attenuation measurements. Lowest velocity variation was produced by 4 MHz toneburst signal.

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Section: B Attenuation Measurementmentioning

confidence: 99%

“…Excitation was performed using a unipolar pulser, capable of rectangular pulses production [12]. Two 2 MHz center frequency ultrasonic transducers TF2C6N from Dopler Inc. were used.…”

Section: A Experimental Setupmentioning

confidence: 99%

See 1 more Smart Citation

Epoxy cure monitoring using ultrasonic spread spectrum binary signals

Liaukonis

Aleksandrovas

Svilainis

2014

2014 IEEE 2nd Workshop on Advances in Information, Electronic and Electrical Engineering (AIEEE)

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“…The polished 30 mm height and 20 mm diameter stainless steel cylinder was immersed in water tank (refer Fig. 1) and reflections collected using ultrasonic data acquisition system [8]. Transducer excitation was done using a unipolar pulser, using 10 V rectangular pulse of 50 ns duration for 10 MHz transducers and 100 ns duration for 5 MHz transducers.…”

Section: The Ultrasonic Signalsmentioning

confidence: 99%

“…If probing signal is of indefinite bandwidth such problem does not exist, but bandwidth is always limited in practice [6,7]. Furthermore, limited bandwidth is usually desirable, because signal acquisition system requirements can be relaxed [8], attenuation of ultrasound at high frequencies produces structural noise and signal degradation [9]. Deconvolution is used to address this problem [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Approximation performance of model functions for blind deconvolution of ultrasonic reflections

Lukoševičiūtė¹,

Drulyte²,

Svilainis³

2016

J. vibroeng.

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Abstract.Comparison of the approximation performance of the ultrasonic reflections by simple model functions used in blind deconvolution is presented. New model function was proposed where causality of the signal is easily modelled without the need for piecewise-linear equations. Parameter estimation technique was developed. Performance investigation was done for three model functions using four experimentally collected ultrasonic signals under different signal filtering conditions.

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High frequency focused imaging for ultrasonic probe integrity inspection

Svilainis

Kybartas

Aleksandrovas

et al. 2020

NDT & E International

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Most ultrasonic probes present a layered structure that may comprise delay lines, acoustic lens, wear plates, matching layers, electrodes, piezoelectric layers, and a backing block. Probe integrity can be compromised by different defects, such as deficient bonding, presence of air bubbles or porosity, lack of electrical conductivity in electrodes, and deviations in the layers' acoustic thicknesses, impedances or attenuation values. Conventional testing procedures are based on the integral properties of the probe, such as acoustic directivity, sensitivity, and electrical impedance. An alternative technique for the non-destructive inspection of the probe's integrity is presented in this study. The proposed technique is based on imaging of the internal structure using a higher frequency focused ultrasound. Scanning the probe's surface using this focused beam provides two imaging modes: reflection and transmission. In the reflection mode, the higher intensity of the echoes indicates the presence of the defects, such as disbonds, poor acoustic matching or porosity. The main novelty of the proposed technique is in the transmission mode: the probe's electric response to the high frequency focused beam is used to get a 2D distribution of transduction efficiency. Moreover, the probe's response can be gated to separate, both front and back side, responses in the time domain, so the local integrity of an electroacoustic structure is evaluated. To verify the proposed technique, a focused 20 MHz transducer with a focal spot diameter of 0.35 mm was mounted on an ultrasonic scanner and immersed in water above the surface of the probe to be tested. Signals were gated by the layers' thickness, giving the C-scan images corresponding to the different material interfaces inside the tested probes: front face, matching layers, piezoelement and backing. It was demonstrated that the resulting C-scan images are informative in evaluating probe's integrity and layers' acoustic thickness. Comparison of the C-scan images obtained in the reflection and transmission modes shows a good agreement in the structure deficiencies evaluation. The technique proposed is attractive due to its simplicity. It can be useful in several applications: i) the probes already in use can be verified and if any deficiencies are detected, the information obtained can be used to evaluate and guide repair; ii) fabrication quality can be verified by confirming the adhesion of layers and parameters in 2D; and iii) the development of new fabrication routes can be guided, where adherence, compatibility, homogeneity, etc. of new materials or new technologies can be evaluated.

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Electronics for Ultrasonic Imaging System

Cited by 15 publications

References 20 publications

Epoxy cure monitoring using ultrasonic spread spectrum binary signals

Epoxy cure monitoring using ultrasonic spread spectrum binary signals

Approximation performance of model functions for blind deconvolution of ultrasonic reflections

High frequency focused imaging for ultrasonic probe integrity inspection

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