Electronic module assembly

Low-Permittivity and Low-Temperature Cofired BaSO4–BaF2 Microwave Dielectric Ceramics for High-Reliability Packaged Electronics

“…5,6 However, the reliability of packaging in these processes is affected by the matching of the coefficient of thermal expansion (CTE) between packaged components, which include organic laminates, ceramic substrates, solders, active/passive devices, encapsulating glass, electrodes, and others. 6,7 For instance, SMT uses lead-free or short lead surfaces to mount components, while SIP primarily involves a ball grid array (BGA) package, which requires matching the CTE between the substrate, passive devices, or solders. CTE mismatch between components usually results in significant thermal stress in packaged electronics, causing solder fatigue and package failure.…”

“…Several advanced packaging and assembly technologies have emerged to meet the demand for miniaturization and integration of electronic products, such as surface mount technology (SMT), multichip modules, and system-in-package (SIP). , However, the reliability of packaging in these processes is affected by the matching of the coefficient of thermal expansion (CTE) between packaged components, which include organic laminates, ceramic substrates, solders, active/passive devices, encapsulating glass, electrodes, and others. , For instance, SMT uses lead-free or short lead surfaces to mount components, while SIP primarily involves a ball grid array (BGA) package, which requires matching the CTE between the substrate, passive devices, or solders. CTE mismatch between components usually results in significant thermal stress in packaged electronics, causing solder fatigue and package failure. , Therefore, thermal matching with printed circuit boards (PCBs) and solders must first be addressed if LTCC products are to be used in advanced packaged electronics or high-density integrated circuits.…”

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

“…It is essential in real-world applications to analyze the conditions of the stencil aperture wall surface that corresponds to the solder paste release on the PCB pad during the stencil printing process. During the stencil printing process, this hidden issue affects the efficiency of solder paste release on the PCB pad Figure 1 Illustration of solder paste printing process (Alelaumi et al, 2020;Franke et al, 2021;Sunar et al, 2022;Yu et al, 2019). Research on the lifespan of the electroform PVD stencil and the quality of the stencil aperture wall surface is less common, and it has rarely been examined.…”

“…Surface mount technology (SMT) is a technology to assemble electronic components up to a wide range of complex electronic devices (Franke et al , 2021; Liu et al , 2023; Xu et al , 2020). In SMT, there are three primary activities of a surface mount assembly line mainly stencil printing process, pick and place and solder reflow (Tsai, 2008).…”

Design of elastic and dissipation joints in bearing structures of electronic packages

“…Numerous publications devoted to stresses assessment [1] and mechanical strength control [2] for electronic packages, and in particular to printed circuit boards [3], subjected to bending and shear forces [4] and undergoing dynamic deformations [5], performance of dynamic analysis [6] and reliability [7] using vibration reduction design [8] and vibration suppression methods [9,10] indicate of insufficient strength and reliability of modern electronic packages explored in harsh conditions of variety of impacts including mechanical shocks and vibration. Mathematical modeling and experimental research represented in this paper is aimed at dynamic force analysis of circuit cards in order to eliminate or reduce dynamic stress to an acceptable level and to provide strength and reliability in design of circuit card assemblies subjected to vibration.…”