Design of elastic and dissipation joints in bearing structures of electronic packages

Abstract

Mathematical modeling and experimental research represented in this paper is aimed at dynamic force analysis of circuit cards in order to eliminate or reduce dynamic stress and deflection to an acceptable level and to provide strength and reliability in design of circuit card assemblies subjected to vibration. In conditions when viscous friction forces are negligible and viscous friction dampers, such as liquid dampers, cannot be used reduction of oscillation amplitude in critical frequencies was proposed by creating dry friction damper. On the base of mathematical model, the method for reducing dynamic stress and deflection in critical section of circuit cards in resonance conditions has been developed by inserting additional elastic and dissipation joint introduced by dry friction damper. The dry friction damper device is introduced in three variants of design. The effectiveness of dry friction damper is characterized by its elastic and damping characteristics and especially by the stiffness.