Electronic Hardware Reliability

Ramakrishnan, Arun; Syrus, T.; Pecht, Michael

doi:10.1201/9781420036879.ch22

Cited by 5 publications

(3 citation statements)

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“…The life cycle environment of a product consists of the assembly, storage, handling, and use of the product (application and operational loads), including the severity and duration of these conditions [5]. Specific life cycle loads include environmental conditions such as temperature, humidity, pressure, vibration or shock, chemical environments, radiation, contaminants, and loads due to operating conditions, such as current, voltage, and power.…”

Section: A Monitoring Critical Parameters Of a Product's Life Cycle mentioning

confidence: 99%

“…Identification of potential failure modes, mechanisms, and sites involves using the geometry and material properties of the product together with the measured life cycle loads acting on the product to identify the potential failure mechanisms, 5 failure sites 6 (e.g., part interconnects, board metallization, and external connections), and failure modes 7 (e.g., electrical shorts or opens) in the product. This task may involve a failure modes and effects analysis (FMEA) and a simulation-based methodology.…”

Section: Physics-of-failure Analysismentioning

confidence: 99%

“…Given the maximum frequency of interest and the number of analysis lines in the power spectral density (PSD) plot, the data recorder calculates the sampling rate and the sample size for signal-triggered analysis according to the following equations [16]: (5) and (6) In order to select the maximum frequency of interest, the data recorder was first programmed to collect data at its highest sampling rate 10 (3072 samples/sec, which corresponds to a maximum measurable frequency of 1200 Hz), and the resulting frequency spectrum was analyzed. It was observed that the PSD of the vibrations was concentrated around 70-200 Hz and the PSD was negligible above 600 Hz.…”

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confidence: 99%

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A life consumption monitoring methodology for electronic systems

Ramakrishnan¹,

Pecht

2003

IEEE Trans. Comp. Packag. Technol.

130

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Failures in electronic products are often attributable to various combinations, intensities, and durations of environmental loads, such as temperature, humidity, vibration, and radiation. For many of the failure mechanisms in electronic products, there are models that relate environmental loads to the time to failure of the product. Thus, by monitoring the environment of a product over its life cycle, it may be possible to determine the amount of damage induced by various loads and predict when the product might fail. This paper describes the development of a physics-of-failurebased methodology for determining the damage or life consumption in a product. As a demonstration of the methodology, a data recorder has been used to monitor the temperature and vibration loads on a printed circuit board placed under the hood of a car. The data collected by the recorder has been used to determine the life consumption in the solder joints of the printed circuit board due to temperature and vibration loading. The calculated remaining life has then been compared with temperature cycling test results on the board to assess the validity of the approach.

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Section: A Monitoring Critical Parameters Of a Product's Life Cycle mentioning

confidence: 99%

Section: Physics-of-failure Analysismentioning

confidence: 99%

mentioning

confidence: 99%

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A life consumption monitoring methodology for electronic systems

Ramakrishnan¹,

Pecht

2003

IEEE Trans. Comp. Packag. Technol.

130

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Life consumption monitoring for electronics prognostics

Mishra

Ganesan

Pecht

et al.

2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720)

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Abstract-Life consumption monitoring is a prognostic method to assess the remaining life of a product in its actual life-cycle environment by continuously or periodically measuring the product's performance parameters and environmental conditions. This paper discusses a generic process to conduct a life consumption monitoring for electronic products. Two case studies on a circuit card assembly in an automobile under-hood environment are presented as application examples of the process. Temperature and vibration were identified as the dominant factors for the failure of the circuit card assembly. The environmental loads were monitored using a data recorder and the remaining life of the card assembly were estimated using physics-of-failure based stress and damage models. The predicted remaining life of the circuit card assembly correlated well with the measurement results.

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