In this study, Mn doped complexes were produced and used as an interfacial layer in Au/Mn-complex/n-Si structure. For this, metal complex was prepared and added with its material. For this, a mixed ligand complex was prepared and dopped with manganese. The morphological investigations of these structures was fulfilled by using an Atomic Force Microscope. The analyzes showed that relatively smooth and well ordered surfaces. The fabricated structured were characterized using capacitance-voltage (C-V) and conductance-voltage (G/w-V).