2005
DOI: 10.1016/j.apsusc.2004.11.060
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Electron induced deposition and in situ etching of CrOxCly films

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Cited by 7 publications
(5 citation statements)
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“…A pressure threshold of 8.6ϫ 10 −4 Pa was found for deposition from CrO 2 Cl 2 . 98 Below this pressure, no Cr deposition was observed. It was found that etching of the ͑Cl-deficient͒ CrO x Cl y film occurred during postdeposition irradiation in the presence of Cl 2 .…”
Section: Precursor Pressurementioning
confidence: 99%
See 1 more Smart Citation
“…A pressure threshold of 8.6ϫ 10 −4 Pa was found for deposition from CrO 2 Cl 2 . 98 Below this pressure, no Cr deposition was observed. It was found that etching of the ͑Cl-deficient͒ CrO x Cl y film occurred during postdeposition irradiation in the presence of Cl 2 .…”
Section: Precursor Pressurementioning
confidence: 99%
“…In SEMs the beam size and/or the beam current usually changes together with the acceleration voltage. 96 In deposition experiments, occasionally the electron currents are measured in situ, 97,98 but in general the yield of emitted electrons is not measured. Elaborate models are being developed 57 that can give valuable insight into how balances shift during deposit growth.…”
Section: B Electron Energymentioning
confidence: 99%
“…It should be noted that diffusion inside of the scan area may also take place. This entire process which is a combination of adsorption, desorption, diffusion and decomposition has been described by a differential equation in detail elsewhere [6].…”
Section: Electron Beam Dwell Time Dependencementioning
confidence: 99%
“…Other etching agents which have been successfully utilized in conjunction with electron beam induced etching include nitrosyl chloride (NOCl) [5] which is capable of selectively etching chromium (Cr) and alumina (Al 2 O 3 ) on SiO 2 . Wang et al [6] reported the successful electron beam induced etching of CrO x using pure chlorine gas in an Auger electron spectrometer with a broad electron beam source. An etching effect of the underlying silicon substrate has also been briefly mentioned in this paper.…”
Section: Introductionmentioning
confidence: 99%
“…In the following list, a single reference is given for each material (generally the most recent publication known to us); for a more complete cross-reference the reader is referred to one of the many general EBID reviews such as Utke et al [17]: Al [18], Au [19], C (abundant literature), Co [20], Cr [21], Cu [22], Fe [23], GaAs [24], Ga [25], Ge [26], Ir [27], Mn [28], Mo [29], Ni [30], Os [31], Pb [32], Pd [33], Pt [34], Rh [35], Ru [31], Si/SiO x [36], Sn [37], Ti [38] and W [39]. The growth of the deposit can be directed to take the shape of the structure that one wishes to fabricate; indeed such exotic three-dimensional structures as nanobridges can be easily produced (figure 2).…”
Section: Introductionmentioning
confidence: 99%