Electron field emission properties of carbon nanoflakes prepared by RF sputtering

Spallation of interfacial Ag–Au–Cu–Zn compounds in Sn–Ag–Cu/Sn–Zn–Bi joints during 210°C reflow

“…In a previous study [30], the spalling Ag-Au-Cu-Zn IMCs in the solder lead to the fracture between ductile solder and brittle Ag-Au-Cu-Zn IMCs which are detrimental to the joint strength. Therefore to prevent the spallation of intermetallic phases is profitable for joint strength.…”

“…Spallation of Ag-Au-Cu-Zn IMCs [13] lead to the fractures occurred at the interface between solder and Ag-Au-Cu-Zn IMC, and between Ag-Au-Cu-Zn IMC and Ni metallization [30], implying that it is detrimental to bonding strength of joints. Sn-Ag-Cu packages with the introduction of Sn-Zn-Bi are rarely investigated and the investigation on the spallation of Ag-Au-Cu-Zn IMCs in Sn-Ag-Cu/Sn-Zn-Bi solder joints is not published yet.…”

Multilayer graphene synthesized using magnetron sputtering for planar supercapacitor application

“…These factors enable compatibility of the deposition method with a wide variety of substrates and make sputtering a technology of choice for various thin film applications. Nevertheless, few studies on nanostructured carbon materials obtained using magnetron sputtering [17][18][19] and even fewer for graphene synthesis 20 have been reported so far. To the best of our knowledge, studies of graphenes synthesized using magnetron sputtering on silicon and metallic foils have not been reported.…”