Spallation of interfacial Ag–Au–Cu–Zn compounds in Sn–Ag–Cu/Sn–Zn–Bi joints during 210°C reflow

Shih, Po-Cheng; Lin, Kwang‐Lung

doi:10.1016/j.jallcom.2006.08.260

Cited by 7 publications

(1 citation statement)

References 36 publications

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“…have been developed as candidates for lead-free solders. Among them, Sn-Zn solder has recently been considered as a suitable candidate for a Pb-free solder material because of its low melting point (198°C) as compared with other Snbased solders, e.g., Sn-Cu (227°C), Sn-Ag (221°C), Sn-Ag-Cu (217°C) as well as its low cost [8][9][10]. In general, the higher melting temperature, in the range of 215-230°C associated with solders (Sn-Cu (227°C), Sn-Ag (221°C)), can damage the other electronic components mounted on the circuit board while reflowing [11].…”

Section: Introductionmentioning

confidence: 99%

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Gain

Chan

Sharif

et al. 2009

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Gain

Chan

Sharif

et al. 2009

Microelectronics Reliability

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Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Fouzder

Chan

et al. 2014

J Mater Sci: Mater Electron

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Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Luo

et al. 2011

Journal of Elec Materi

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Electrochemical corrosion behaviors of Sn-9Zn-3Bi-xCr solder in 3.5 wt.% NaCl solution were investigated in this work through potentiodynamic polarization measurements. After electrochemical testing, fracture surfaces were investigated by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and x-ray diffractometry. The results show that adding a small amount of Cr can improve the corrosion resistance of Sn-9Zn-3Bi-xCr solder. The corrosion potential of Sn-9Zn-3Bi solder is À1.251 V. For Sn-9Zn-3Bi-0.5Cr solder, it is À1.200 V. The corrosion potential increased when raising the Cr content, and the Sn-9Zn-3Bi-0.5Cr solder showed the best corrosion resistance. After polarization, a passivation film covered the surface of the Cr-bearing solders. The higher the Cr content, the more compact the passivation film. Long-term aging worsened the corrosion resistance. After 4 days of aging, the corrosion potential of Sn-9Zn-3Bi solder was À1.254 V. After 9 days, it was À1.268 V.

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Spallation of interfacial Ag–Au–Cu–Zn compounds in Sn–Ag–Cu/Sn–Zn–Bi joints during 210°C reflow

Cited by 7 publications

References 36 publications

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

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