“…Despite a significant research effort and vast literature on electron beam lithography, the detailed molecular mechanisms are still inadequately understood. Published modeling studies address Lithography 294 extensively the processes of electron penetration, scattering, and energy deposition in resist and substrate materials (Kyser & Viswanathan, 1975;Murata et al, 1981;Lee et al, 1992;Raptis et al, 1993;Raptis et al, 2001;Zhou & Yang, 2006), however, the analyses of exposure of resists are mostly limited to conversions of the average amounts of energy deposited by electrons into the average number of relevant molecular events, such as the bond scissions, through the empirically determined radiation chemical yield (Chapiro, 1962;Greeneich, 1974;Han et al, 2003;Kyser & Viswanathan, 1975;Raptis et al, 2001). Furthermore, the detailed molecular processes occurring during dissolution of the most useful resists have been under-addressed if not overlooked so far.…”