2012
DOI: 10.1143/jjap.51.06fb02
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Electron Beam Lithography of 15×15 nm2 Pitched Nanodot Arrays with a Size of Less than 10 nm Using High Development Contrast Salty Developer

Abstract: We investigated the effects of developer and hydrogen silsesquioxane (HSQ) resist thickness in the formation of dot arrays with a pitch of <18×18 nm2 by using 30-keV electron beam (EB) lithography for bit patterned media (BPM). Optimum resist thickness and developer were investigated for the formation of fine dot arrays. We found that a 12-nm-thick HSQ resist was suitable to form fine dot patterns and the addition of NaCl into tetramethylammonium hydroxide (TMAH) could improve the development contrast (γ-va… Show more

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Cited by 13 publications
(12 citation statements)
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“…We can consider that the cross-section is formed by salty developing in EB drawing with HSQ resist. In our previous study on the EB drawing, the EB drawing method has improved the contrast of HSQ-resist EB-drawing and high gamma-value developing [12]. This experimental result agrees with the consideration as described in Fig.…”
Section: Resultssupporting
confidence: 88%
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“…We can consider that the cross-section is formed by salty developing in EB drawing with HSQ resist. In our previous study on the EB drawing, the EB drawing method has improved the contrast of HSQ-resist EB-drawing and high gamma-value developing [12]. This experimental result agrees with the consideration as described in Fig.…”
Section: Resultssupporting
confidence: 88%
“…Here, we set constant thickness of the coated HQS resist to about 25 nm in the EB drawing. Furthermore, we used high resolution EB drawing with salty developer for HSQ resist to get steep side wall of the guide line [12], [16].…”
Section: Resultsmentioning
confidence: 99%
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“…The EB writing system is a combination of a high-resolution scanning electron microscope (SEM) with a Schottky emission-type field-emission electron gun (JSM6500F, JEOL) and a drawing controller (Beam Draw, Tokyo Technology) . To form narrow nanowires with high-resolution, negative-tone resist hydrogen silsesquioxane (HSQ, Dow Corning) and a high-contrast salty development solution , were employed. Normally, a thin HSQ resist layer would be employed to form a high-resolution pattern because the EB scattering range (lateral) in a thin resist layer is smaller than that in a thick resist layer.…”
Section: Methodsmentioning
confidence: 99%
“…This study was conducted by using only guide lines. This is because we cannot form fine dot arrays with a diameter of <10 nm using EB drawing with advanced development. …”
mentioning
confidence: 99%