16th Design Automation Conference 1979
DOI: 10.1109/dac.1979.1600141
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Electron Beam Lithography

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“…One can control the vertical dimensions of the device by controlling the film thickness through parameters such as deposition time, deposition power, etc, or the type of film/stack. In order to reduce the lateral dimensions, modern lithography techniques, such as EUV lithography [15] or e-beam lithography [16,17] are used for patterning denser area devices.…”
Section: Introductionmentioning
confidence: 99%
“…One can control the vertical dimensions of the device by controlling the film thickness through parameters such as deposition time, deposition power, etc, or the type of film/stack. In order to reduce the lateral dimensions, modern lithography techniques, such as EUV lithography [15] or e-beam lithography [16,17] are used for patterning denser area devices.…”
Section: Introductionmentioning
confidence: 99%