Electromigration Reliability of Solder Balls

Hau-Riege, Christine; Yau, You-Wen

doi:10.1109/ipfa.2018.8452576

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Current Effect On Wire-bonded Package Degradation1

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“…Aluminium) induced by the electric current, which can lead to the generation of voids and interconnect failure on the solder layer [36]- [38]. Recently, the electron migration related reliability issue has been taken into consideration at package-level as well as chip-level [37], [39]- [41]. Generally, the current density and the related electromigration effect have impact for both the degradation of bond wire and solder layer.…”

Section: Current Effect On Wire-bonded Package Degradationmentioning

confidence: 99%