2017 IEEE International Integrated Reliability Workshop (IIRW) 2017
DOI: 10.1109/iirw.2017.8361224
|View full text |Cite
|
Sign up to set email alerts
|

Electromigration: Lognormal versus Weibull distribution

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
6
0

Year Published

2018
2018
2023
2023

Publication Types

Select...
6
2

Relationship

0
8

Authors

Journals

citations
Cited by 14 publications
(7 citation statements)
references
References 6 publications
0
6
0
Order By: Relevance
“…Moreover, competing distribution models are approximated using the generalized gamma distribution (GENG), which is widely used for reliability analysis. [18][19][20][21] The gamma distribution for V min is verified and compared with the GENG model. Finally, a simple method for V min estimation of large-scale SRAM macros by extrapolating the gamma distribution fitted line with few data is provided.…”
Section: Introductionmentioning
confidence: 95%
“…Moreover, competing distribution models are approximated using the generalized gamma distribution (GENG), which is widely used for reliability analysis. [18][19][20][21] The gamma distribution for V min is verified and compared with the GENG model. Finally, a simple method for V min estimation of large-scale SRAM macros by extrapolating the gamma distribution fitted line with few data is provided.…”
Section: Introductionmentioning
confidence: 95%
“…This suggests that the lognormal distribution is appropriate for the lifetime distribution of the degradation processes with combinations of random rate constants that relate multiplicatively, like fatigue crack growth in metals. 5) In the field of reliability physics of electron devices, the lognormal distribution is used for the analysis of the electromigration of BEOL interconnects and solder bumps [27][28][29][30][31][32] because the proportional effect model suits the failure mechanism. The reliability of the LSI chip is evaluated using the lognormal distribution for segments.…”
Section: Lognormal Distributionmentioning
confidence: 99%
“…The lognormal assumption for segments has been validated experimentally in many previous studies. 27,28,31,32) Based on this assumption, the chip electromigration reliability estimation has been implemented in many design tools. However, because the circuit and layout design of the chip cannot be certain until the final phase of the product development, the design check can only be performed after they are determined.…”
Section: Background Of Chip-level Lifetime Estimationmentioning
confidence: 99%
See 1 more Smart Citation
“…One may also refer to Johnson et al [18] for several applications of this distribution in various life testing experiments. This distribution is treated as an alternative model to some known distributions like Weibull, gamma and generalized exponential models, see for instance, Basavalingappa et al [10], Raqab et al [33], and Jia et al [17]. Crow and Shimizu [12] discussed the importance of Bayesian inference for the lognormal distribution in various life testing studies.…”
Section: Introductionmentioning
confidence: 99%