Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes

Dong, Xinxin; Zhu, Pengxiao; Li, Zhonghua; Sun, Jun; Boyd, John

doi:10.1016/j.microrel.2010.01.002

Cited by 4 publications

(1 citation statement)

References 42 publications

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“…So far, the interaction between the variation of matter distribution along the interfaces (including thin metal film/protective layer interface and grain boundary) and stresses based on a rigid grain model has been extensively studied [7,9,15,16]. To ensure that the material in the interfaces is uniformly distributed, this model assumes that diffusion is fast enough along the interfaces.…”

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confidence: 99%

Growth behavior of voids randomly distributed at grain boundary on thin metal film with bamboo microstructures under thermal residual stress field and electric field

Sun

Liu

et al. 2015

EPL

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Based on the rigid grain hypothesis, an analytic expression is developed to investigate the grain boundary void growth on a thin metal film with bamboo microstructures under thermal residual stress field and electric field. The effect of the microstructure of the thin metal film, thermal residual stress, applied electric field, and diffusivity ratio between the grain boundary and the interface on the growth behavior of the voids and the stress evolution is evaluated. The result shows that the thin metal film with fine grains near the anode end may inhibit void nucleation and growth, which is beneficial for the optimization design of the thin metal film with bamboo microstructures.

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mentioning

confidence: 99%

Growth behavior of voids randomly distributed at grain boundary on thin metal film with bamboo microstructures under thermal residual stress field and electric field

Sun

Liu

et al. 2015

EPL

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show abstract

Transverse creep and stress relaxation induced by interface diffusion in unidirectional metal matrix composites

2012

Composites Science and Technology

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Interface diffusion-induced creep and stress relaxation in unidirectional metal matrix composites under biaxial loading

2014

Mechanics of Materials

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Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes

Cited by 4 publications

References 42 publications

Growth behavior of voids randomly distributed at grain boundary on thin metal film with bamboo microstructures under thermal residual stress field and electric field

Growth behavior of voids randomly distributed at grain boundary on thin metal film with bamboo microstructures under thermal residual stress field and electric field

Transverse creep and stress relaxation induced by interface diffusion in unidirectional metal matrix composites

Interface diffusion-induced creep and stress relaxation in unidirectional metal matrix composites under biaxial loading

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