Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Hu, Yu; Lin, Yifan; Kao, C. R.; Tu, King‐Ning

doi:10.1557/jmr.2003.0355

Cited by 132 publications

(64 citation statements)

References 12 publications

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“…This are was believed to have the highest local current density and the highest degree of current crowding initially. [2][3][4][5][6][7][8][9][10] Figure 5 is a zoom-in image for the left side of the void shown in Fig. 2b.…”

Section: Osp Surface Finishmentioning

confidence: 99%

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Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Lin

Lai

Tsai

et al. 2006

Journal of Elec Materi

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Two substrate surface finishes, Au/Ni and organic solderable preservative (OSP), were used to study the effect of the surface finish on the reliability of flip-chip solder joints under electromigration at 150°C ambient temperature. The solder used was eutectic PbSn, and the applied current density was 5 3 10 3 A/cm 2 at the contact window of the chip. The under bump metallurgy (UBM) on the chip was sputtered Cu/Ni. It was found that the mean-timeto-failure (MTTF) of the OSP joints was six times better than that of the Au/Ni joints (3080 h vs. 500 h). Microstructure examinations uncovered that the combined effect of current crowding and the accompanying local Joule heating accelerated the local Ni UBM consumption near the point of electron entrance. Once Ni was depleted at a certain region, this region became nonconductive, and the flow of the electrons was diverted to the neighboring region. This neighboring region then became the place where electrons entered the joint, and the local Ni UBM consumption was accelerated. This process repeated itself, and the Ni-depleted region extended further on, creating an ever-larger nonconductive region. The solder joint eventually failed when the nonconductive region became too large, making the effective current density very high. Accordingly, the key factor determining the MTTF was the Ni consumption rate. The joints with the OSP surface finish had a longer MTTF because Cu released from the substrate was able to reduce the Ni consumption rate.

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Section: Osp Surface Finishmentioning

confidence: 99%

“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14] To counter the negative effects caused by high current density, several approaches have been proposed and deployed. Two well-known approaches involve better circuit and interconnect designs.…”

Section: Introductionmentioning

confidence: 99%

Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Lin

Lai

Tsai

et al. 2006

Journal of Elec Materi

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“…Цей процес також супроводжується утворенням пор на катоді між ІМС та циною. Таким чином катода поступово розчиняється в цині, а атоми Cu з нього приймають участь у рості ІМС на аноді [19,20]. В нашому експерименті таке перенесення неможливе, але результат залишається незмінним.…”

Section: результати експерименту та їх обговоренняunclassified

Influence of Electromigration on Kinetics of Reaction Diffusion in the Cu—Sn System

Zraev¹

2016

Metallofiz. Noveishie Tekhnol.

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Проведено експериментальне дослідження реакційної дифузії в системі Cu-Sn під дією постійного електричного струму густиною у 7,310 7 А/м 2 . Особливістю експерименту було те, що конструкція досліджуваного зраз-ка виключала можливість перенесення атомів Купруму від катоди до ано-ди через спільний прошарок цини. За таких умов ріст фази Cu 3 Sn  Cu 6 Sn 5 на аноді відбувається швидше, ніж на катоді. Кінетика росту відповідає лінійному часовому закону x  t. З використанням моделю процесу реа-кційної дифузії при електроміґрації було проведено аналізу одержаних експериментальних результатів.Ключові слова: електроперенесення, реакційна дифузія, інтерметалева сполука, Cu/Sn.The experimental study of the reaction diffusion under direct electric current in Cu-Sn system at temperature of 275C is performed. The current density is of 7.310 7 А/m 2 . In these experiments, anode and cathode have no joint contact through the solder layer. With this design of sample, the diffusion of copper atoms from the cathode to the anode is impossible. In these experimental conditions, the growth of the Cu 3 Sn  Cu 6 Sn 5 phase on the anode is faster than on the cathode. The growth kinetics of phase on the electrodes corresponds to a linear time law x  t. The voids' growth on the cathode is not observed. When the anode is joined to cathode by the solder layer, the Corresponding author: Semen Viktorovych Kornienko

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“…3 Relevant studies indicate that electromigration can induce significant microstructural changes and different intermetallic growth in the solder joint systems. [4][5][6][7][8][9][10][11][12][13] The microstructural changes include void nucleation and propagation, hillock formation, and phase segregation. In the eutectic SnPb solder, it was found that electromigration could force Pb atoms to migrate along the direction of electron flow and accumulate at the anode side.…”

Section: Introductionmentioning

confidence: 99%

Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing

Chen

Huang

Liao

et al. 2007

Journal of Elec Materi

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Effects of Cu doping on the microstructural evolution in the eutectic SnBi solder stripes under annealing and current stressing were investigated. Coarsening of the Bi grains was observed in the eutectic SnBi solder upon annealing at 85°C. Doping of 1 wt.% Cu could significantly reduce the grain coarsening rate from 2.8 to 0.5 lm 3 /h. In addition to grain coarsening, mass accumulation of Bi at the anode and solder depletion at the cathode of the eutectic SnBi solder stripe stressed by a current of 1.3 · 10 4 A/cm 2 at 85°C were also observed. Doping of 1 wt.% Cu could also reduce the grain coarsening of the solder under current stressing; however, it resulted in an enhancement of the electromigration effect. Accumulation of Bi at the anode and the solder depletion at the cathode became more severe in the Cu-doped solder stripe.

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Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Cited by 132 publications

References 12 publications

Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Influence of Electromigration on Kinetics of Reaction Diffusion in the Cu—Sn System

Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing

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