Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density

Ha, Sang-Su; Kim, Jong‐Woong; Yoon, Jeong‐Won; Ha, Sang-Ok; Jung, Seung‐Boo

doi:10.1007/s11664-008-0574-5

Cited by 19 publications

(3 citation statements)

References 16 publications

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“…By increasing the added amount of the nanocomposite reinforcing agent Ni-MWCNTs to 0.2 Wt.%, the density was continuously reduced to 95% of the theoretical value of the SAC solder alloy. This was because the compaction resistance of the composite solder powder mixture increased with the increasing content of the Ni-MWCNTs (Ha et al , 2009). Figure 2(b) shows the relationship between the content of Ni-MWCNT reinforcement and the microhardness of the nanocomposite solder.…”

Section: Resultsmentioning

confidence: 99%

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Zhai

Chen

2021

SSMT

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Purpose The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints and improve the reliability of solder joints. Although many people have conducted in-depth research on the composite solder of Ni-MWCNTs. However, no one has studied the performance of Ni-MWCNTs composite solder under different aging conditions. In this article, Ni-MWCNTs was added to Sn-Ag-Cu (SAC) solder, and the physical properties of composite solder, the microstructure and mechanical properties were evaluated. Design/methodology/approach In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite solder was studied. Compared with SAC307 solder alloy, the influence of Ni-MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on composite solder was examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 80°C, 120°C and 150°C. Findings The experimental results show that the content of Ni-MWCNTs affects the morphology and growth of the IMC layer at the interface. The microhardness of the solder increases and the wetting angle decreases. After aging at moderate (120°C) and high temperature (150°C), the morphology of the Cu6Sn5 IMC layer changed from scallop to lamellar and the grain size became coarser. The following two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The fracture surface of the solder joints all appeared ductile dents, and the size of the pits increased significantly with the increase of the aging temperature. Through growth kinetic analysis, Ni-modified MWCNTs in composite solder joints can effectively inhibit the diffusion of atoms in solder joints. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the highest shear strength. Originality/value In this study, the effects of aging conditions on the growth and shear strength of the IMC layer of Ni modified MWCNTs reinforced SAC307 composite solder were studied. The effects of Ni MWCNTs with different contents (0, 0.1 and 0.2 Wt.%) on the composite solder were examined.

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Section: Resultsmentioning

confidence: 99%

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Zhai

Chen

2021

SSMT

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“…However, scale reduction of electronic products increases the current density in solder joints, resulting in enhanced electromigration effects, which can cause reliability problems. [5][6][7][8][9][10] Electromigration refers to the phenomenon of directional atomic movement induced by current stressing, 11,12 which can induce significant microstructural changes, such as void and hillock formation and phase segregation, and affect growth of intermetallic compounds in solder joints. [13][14][15][16][17] To the best of our knowledge, electromigration in Bi-added SnAgCu solder has not been reported to date.…”

Section: Introductionmentioning

confidence: 99%

Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing

Lee

Chen

2011

Journal of Elec Materi

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The electromigration behavior of a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi solder stripe between two Cu electrodes under current stressing at various densities has been investigated for a current stressing time of 72 h and a temperature of 120°C. After current stressing at a density of 1.0 9 10 4 A/cm 2 , the solder matrix exhibited a slight microstructural change as well as formation of a distributed Cu 6 Sn 5 phase near the anode-side solder/Cu interface. Upon increasing the current density to 3.9 9 10 4 A/cm 2 and 5.0 9 10 4 A/cm 2 , a high density of distributed Cu 6 Sn 5 phase was formed across the entire solder stripe, resulting in pronounced microstructural change of the solder. Hillocks were also formed near the anode-side interface due to accumulation of a Sn-rich phase, a Bi-rich phase, and a distributed Cu 6 Sn 5 phase, while voids were formed in the solder matrix and at the opposite cathode side. The mechanisms of formation of the distributed Cu 6 Sn 5 phase and migration of Bi and Sn are discussed.

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“…[1][2][3][4] As the high current density stressing through the micro solder joints, EMinduced failures seriously threaten the reliability of the flip-chip and 3-D IC package. 5,6,10 Up to now, peoples found that the EM-induced failures typically occurred at the cathode joint interface. The EMinduced cathode metal-pads consumption is one of the major EMinduced failure modes.…”

mentioning

confidence: 99%

Back-Fill Sn Flux against Current-Stressing at Cathode Micro Cu/Sn Interface

Liu

Hsu

et al. 2013

ECS Solid State Letters

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Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density

Cited by 19 publications

References 16 publications

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing

Back-Fill Sn Flux against Current-Stressing at Cathode Micro Cu/Sn Interface

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