Electromagnetic Considerations for Designing Double-Sided Power Modules

Abstract

Double-sided power modules are especially attractive due to high thermal performances. Thanks to the stacking of two DBCs, very low stray inductances may be expected, especially because of the proximity of the two rear metallization. On the other hand, capacitive effects may be increased. In this paper, the complete electromagnetic behaviour of double sided power modules is studied, regarding both internal coupling, and unwanted EMC emissions. Some layout and active solutions are proposed to reduce common mode emissions.

Reduction of conducted EMC using busbar stray elements

“…However, for bigger structures, higher capacitance can be expected, and therefore, the EMI reduction will be effective even for lower frequencies. Furthermore, for low frequencies active solutions have been shown to be good candidates in conjunction with integrated solutions [9].…”

Automatic layout optimization of a double sided power module regarding Thermal and EMC constraints

“…The technology chosen for integrated inverter realization is the double sided technology [2][3]. It brings several interesting features, such as a better chip cooling by limiting the number of interfaces from silicon component to cooling fluid, and also reduced interconnection stray inductances, using a stacking of chips and substrates.…”

“…All constraints related to the technological realization and the disposition of the external connection will be taken into account. The proposed example, a 2kW inverter for aircraft application, realized in double sided technology [2][3] will be presented in section II. Section III will detail the optimization models, to account for both thermal and EMC aspects.…”