Electroless plating of copper on surface-modified glass substrate

Supercritical CO2 reactor for wafer-scale thin film deposition: reactor concept, numerical results, and Cu depositio.

“…The film resistivity of the Cu film deposited 185 • C was 5.2 cm, and a similar value (6.1 cm) was obtained for the film deposited at 200 • C. These values are much higher than the bulk resistivity of Cu (1.6 cm), but are consistent with values reported for Cu chemically deposited on glass [29,30]. This is presumably due to a small grain structure as seen in Fig.…”

Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters

“…However, metallisation on smooth glass surfaces is difficult due to the physical, chemical and mechanical mismatches between the metal coating and the glass substrate [2,3]. Without adequate adhesion, metallised coatings tend to delaminate and not perform the task for which they are intended.…”

High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating

“…Electroless plating is a widely-used method for metallization of ceramics, due to its low cost and fast deposition at low processing temperature [7,8]. In spite of these advantages of electroless plating, the weak adhesion originates from van der Waals forces between the atoms of the metal layer and the ceramic substrate has prohibited the application of this technique [9,10].…”