Electroless Metallization of Glass Surfaces Functionalized by Silanization and Graft Polymerization of Aniline

Chen, Yongjun; Kang, En‐Tang; Neoh, K. G.; Huang, Wei

doi:10.1021/la010866y

Cited by 43 publications

(33 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[4][5][6][7] Development of through substrate interconnect via hole formation technology for glass has progressed however, metallization technology relies on vacuum deposition, the silver mirror reaction or surface roughening followed by electroless plating for conductive seed layer formation. [8][9][10][11] Using sputtered Cu, Ti/Cu or Cr base layers, relatively high adhesion strength has been attained. [12][13][14] However, dry processes have productivity limiting disadvantages such as size restriction, need for expensive equipment and high running cost.…”

mentioning

confidence: 99%

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Okabe

Kagami

Horiuchi

et al. 2016

J. Electrochem. Soc.

View full text Add to dashboard Cite

A method for copper deposition on glass and ceramics was investigated by direct plating on 20-30 nm thick copper inclusive titanium oxide films formed on the substrate surface. The copper inclusive titanium oxide film functioned as an adhesion layer and as a catalyst for autocatalytic copper deposition. Copper inclusive titanium oxide films were formed by pyrolysis of solution deposited 1-hydroxy phenyl ketone titanium-copper complex films. After deposition of electroless copper seed layers, 15-20 μm thick electrolytic copper films were formed, where upon thermal treatment up to 0.5 kN/m adhesion strength was attained on borosilicate glass. This process enabled electroless copper plating without the use of palladium as a catalyst on non-roughened smooth glass or ceramic substrate surfaces. The copper-titanium oxide adhesion layers were characterized and cross-sectional transmission electron microscopy illustrated the adhesion mechanism and catalyst structure. Despite poor thermal conductivity, due to properties such as transparency, smooth surface, chemical and thermal stability, coefficient of thermal resistance, dielectric constant, electrical insulation and physical strength, glass has gained attention an electronic substrate material.1-3 Two examples are in 2.5 D/3 D electronic device and RF module packaging. [4][5][6][7] In addition to these properties, abundance and availability in a wide range of shape and size make glass an attractive economic substitute for silicon in interposers. [4][5][6][7] Development of through substrate interconnect via hole formation technology for glass has progressed however, metallization technology relies on vacuum deposition, the silver mirror reaction or surface roughening followed by electroless plating for conductive seed layer formation. [8][9][10][11] Using sputtered Cu, Ti/Cu or Cr base layers, relatively high adhesion strength has been attained.12-14 However, dry processes have productivity limiting disadvantages such as size restriction, need for expensive equipment and high running cost. Therefore, economic wet methods have been studied as an alternative. In direct electroless plating methods, adhesion between the glass and the plated films has been accomplished by etching the glass surface with hydrofluoric acid, but with the sacrifice of its original transparency and smoothness. [15][16] Furthermore, employment of expensive palladium catalyst also introduces the need for a palladium removal procedure in order to prevent migration and short circuits that lead to poor device reliability. [17][18][19] Solution processed adhesion layers for direct electroless plating on glass have been demonstrated where a few tens of nanometer thick Pd-NiO, 20 Pd grafted TiO 2 , 21 or Pd-SnO 2 22 films served as catalytic anchor layers. Based on those results, the method outlined in Figure 1 for direct electroless copper plating on the substrate was investigated, where the catalytic anchor layer consisting of copper and titanium oxides was formed by pyrolysis of a metal complex film ...

show abstract

mentioning

confidence: 99%

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Okabe

Kagami

Horiuchi

et al. 2016

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…In addition to the direct surface-grafting methods mentioned above, N-containing nonionic polymers can be synthesized by postmodification of surface-grafted polymers. Kang et al reported several works in this strategy, including the silanization of a poly(2-hydroxyethyl acrylate-grafted PTFE surface or a poly[n-(hydroxymethyl)methacrylamide]grafted PTFE surface with N- [3-(trimethoxysilyl)propyl]diethylenetriamine, [51] the reduction of polyaniline-grafted PTFE [52] and glass, [53] and the amidoximation of PAN-grafted FEP films. Copper thin films deposited by ELD on these postmodified polymers showed excellent adhesion to the substrate in peeling tests.…”

Section: Nonionic Polymers For Eldmentioning

confidence: 99%

Surface‐Grafted Polymer‐Assisted Electroless Deposition of Metals for Flexible and Stretchable Electronics

Liu

Zhou

et al. 2012

Chemistry An Asian Journal

View full text Add to dashboard Cite

Surface-grafted polymers, that is, ultrathin layers of polymer coating covalently tethered to a surface, can serve as a particularly promising nanoplatform for electroless deposition (ELD) of metal thin films and patterned structures. Such polymers consist of a large number of well-defined binding sites for highly efficient and selective uptake of ELD catalysts. Moreover, the polymer chains provide flexible 3D network structures to trap the electrolessly deposited metal particles, leading to strong metal-substrate adhesion. In the past decade, surface-grafted polymers have been demonstrated as efficient nanoplatforms for fabricating durable and high-performance metal coatings by ELD on plastic substrates for applications in flexible and stretchable electronics. This focus review summarizes these recent advances, with a particular focus on applications in polymeric flexible and stretchable substrates. An outlook on the future challenges and opportunities in this field is given at the end of this paper.

show abstract

“…Conducting polymers have been widely investigated due to their potential applications in transparent electrodes, chemical and biological sensors, electrical and optical materials, heavy metal-ion sorption, etc [9][10][11][12][13]. Polyaniline (PANI) is one of the most remarkable conducting polymers owing to advantages such as easiness of synthesis by chemical or electrochemical polymerization, good environmental stability and oxidation, or protonation-adjustable electrical property [14].…”

Section: Introductionmentioning

confidence: 99%

Poly(tetrafluoroethylene) composite membranes coated with urchin-like polyaniline hiberarchy: Preparation and properties

Shi

Zhou

Dai

et al. 2012

Journal of Colloid and Interface Science

View full text Add to dashboard Cite

Electroless Metallization of Glass Surfaces Functionalized by Silanization and Graft Polymerization of Aniline

Cited by 43 publications

References 39 publications

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Surface‐Grafted Polymer‐Assisted Electroless Deposition of Metals for Flexible and Stretchable Electronics

Poly(tetrafluoroethylene) composite membranes coated with urchin-like polyaniline hiberarchy: Preparation and properties

Contact Info

Product

Resources

About