Electroless deposition of Co–Mo–P alloys

This paper reports an experimental study of corrosion characteristics of electroless Ni-P-TiO 2 nanocomposite coatings. Coating process parameters are optimised for maximum corrosion resistance based on L 9 Taguchi orthogonal design with four process parameters, namely, concentration of nickel source solution, concentration of reducing agent, concentration of TiO 2 powder and bath temperature. Corrosion behaviour of the electroless Ni-P-TiO 2 nanocomposite coatings was evaluated in 3?5 wt-%NaCl aqueous solution using polarisation technique. Scanning electron microscopy and energy dispersive X-ray spectroscopy analysis were used for studying surface morphology and chemical composition of the electroless Ni-P-TiO 2 nanocomposite coatings. The results showed that incorporation of TiO 2 in coating causes an increase in corrosion resistance and improves surface morphology. Finally, optimum conditions were achieved as follows: concentration of nickel source solution, 50 g L 21 ; concentration of reducing agent, 10 g L 21 ; concentration of TiO 2 powder, 10 g L 21 ; and bath temperature, 85uC.

Section: Introductionmentioning

confidence: 99%

Corrosion behaviour of electroless Ni–P–TiO₂ nanocomposite coatings using Taguchi

Hosseini

Bodaghi

2013

“…15,16 In the case of DPhTU (Figs. [6][7][8], HOMO and LUMO were effectively localised on one of the phenyl moiety, whereas another phenyl ring is partly confined with HOMO and LUMO. This indicates that DPhTU has not effectively adsorbed on the metal surface and in turn diminished the acceleration of electroless deposition.…”

Section: Quantum Mechanical Studiesmentioning

confidence: 97%

“…As pointed out by Han and Fang 1 and others, [2][3][4] sulphur bearing organic compounds such as cystein, thioglycolic acid and some thiourea derivatives were reported as accelerators for electroless plating process. [5][6][7][8] However, there has been no published report on the acceleration effect of p-tolyl thiourea (p-TLTU) and diphenyl thiourea (DPhTU) on electroless nickel plating. This paper explains the influence of p-TLTU and DPhTU on the rate of electroless nickel plating and energy of activation.…”

Section: Introductionmentioning

confidence: 99%

Quantum mechanical approach for electroless plating process

Karthikeyan

Jeeva

Narayanan

et al. 2012

A high speed electroless nickel plating bath has been developed with p-tolyl thiourea and diphenyl thiourea as accelerators for electroless nickel plating process. The acceleration effect of the compounds was determined by weight gain and electrochemical method. Both compounds improved the rate of deposition to considerable extent by adsorbing strongly on the steel surface. The adsorption of the accelerators was found to obey Langmuir adsorption isotherm. The Arrhenius plot and quantum mechanical parameters further justified the impressive performance of accelerators through their effective adsorption on metal surface.

“…The electroless deposition has emerged as a potential alternative to the PVD-based process of depositing thin conductive seed layers. Electroless deposition, on the contrary, is an all-wet process that metallizes insulating substrates using chemical reactions [42][43][44][45][46][47][48]. It can create thin metallic layers on various metals and non-metals [49][50][51][52][53][54][55][56][57][58][59][60].…”

Section: Introductionmentioning

confidence: 99%

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Pawar

Dixit

2022

This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.