Electroless Deposition of Au:In Alloys for Ohmic Contacts onto Pd‐Activated n ‐ GaAs Substrates

Lamouche, D.; Cléchet, P.; Martin, J. R.; Haroutiounian, E.; Sandino, J.P.

doi:10.1149/1.2100533

Cited by 8 publications

(4 citation statements)

References 2 publications

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“…Conclusions. Hydrogenation of 1 by dihydrogen gas over Pt at −10 °C is among the lowest energy processes we are aware of for deposition of adatoms of a foreign metal on the surface of another metal . It appears to allow for the first time generation of a prototypic kinetic bimetallic surface with real time control over the stoichiometry and activity of the evolving surface.…”

Section: Resultsmentioning

confidence: 99%

Hydrogenation of Ru(1,5-cyclooctadiene)(η³-C₃H₅)₂over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

et al. 1997

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Black Pt effected the hydrogenation of Ru(COD)(η 3 -C 3 H 5 ) 2 (1; COD is 1,5-cyclooctadiene) by dihydrogen gas (pressure ∼1 atm) at -10°C in hexanes. The hydrogenation resulted in adsorption of Ru adatoms by the surface of Pt with concomitant formation of propane, cyclooctane, and small amounts of cis-bicyclo[3.3.0]octane and n-octane. Compound 1 did not react with dihydrogen gas under these conditions in the absence of Pt. The total amount of cyclooctane, bicyclo[3.3.0]octane, and n-octane in solution was equal to the amount of 1 consumed at all stages of the hydrogenation. The lifetimes of the organic fragments on the surface were short on the time scale of the hydrogenation. It was therefore possible to observe in real time both the stoichiometry and the activity of the evolving Ru-Pt surface by monitoring the concentrations of either 1 or the C 8 product hydrocarbons in solution.There was a kinetic burst during the initial stages of the hydrogenation that ended after deposition of 0.2-0.5 equiv of Ru versus Pt surface (Pt surface is an active site on black Pt). The rate decreased after the burst and then increased as more Ru was deposited on Pt to reach a maximum, constant rate after deposition of 1.5-1.8 equiv of Ru. Cyclic voltammograms recorded in 1.0 M H 2 SO 4 of the bare surface, of the surface after adsorption of a monolayer of carbon monoxide, and of the surface in the presence of methanol showed that coverage of Pt by Ru was essentially complete after the maximum, constant rate was achieved during hydrogenation of 1. The surface area of a Ru surface resulting from hydrogenation of 2.7 equiv of 1 was 67% that of the original Pt surface according to the charge associated with oxidation of an adsorbed monolayer of carbon monoxide. Anodic stripping of Ru showed that the total of C 8 hydrocarbon products in solution after hydrogenation of 1 equaled the amount of Ru deposited on Pt. A catalyst surface resulting from hydrogenation of 0.11 equiv of 1 was up to ∼14 times more active than bare Pt for the potentiodynamic oxidation of methanol ([MeOH] ) 1.0 M, [H 2 SO 4 ] ) 0.5 M, 40°C, sweep rate 5 mV/s). A catalyst surface resulting from hydrogenation of 0.33 equiv of 1 oxidized methanol potentiostatically at 0.158 V (vs SCE, [MeOH] ) 0.5 M, [H 2 SO 4 ] ) 0.5 M, 25°C) for 45 min with ∼13 times the activity of Pt under the same conditions. A catalyst surface resulting from deposition of 0.8 equiv of Ru oxidized methanol potentiostatically at 0.256 V (vs SCE) under the above conditions for a total of 1.5 h with negligible dissolution of Ru into the electrolyte.

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Section: Resultsmentioning

confidence: 99%

Hydrogenation of Ru(1,5-cyclooctadiene)(η³-C₃H₅)₂over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

et al. 1997

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“…At that time, we showed that a suitable combination of autocatalytic and displacement reactions can be used successfully in that field. We first described a process (7) in which the successive autocatalytic deposition of tin and gold, with baths proposed by Molenaar and Coumans (8) and D'asaro et al (9), respectively, onto n-GaAs surfaces previously activated by a palladium deposit, lead to low-resistive contacts (about 2.10 -4 t2 cm 2) after heat-treatment at 420~ Other conclusive results were published by us afterward, using either pure gold (10) or indium:gold alloys (11) on the same preactivated GaAs substrates, and by Korde and Weinketz on p-InP by deposition of a zinc-cobalt alloy (12). In the working processes described in the above-cited paper on goldbased contacts onto n-GaAs, there were three main complicating drawbacks.…”

mentioning

confidence: 79%

Autocatalytic Deposition of Gold and Palladium onto n ‐ GaAs in Acidic Media

Stremsdoerfer

Perrot

Martin

et al. 1988

J. Electrochem. Soc.

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Deposition of gold, palladium, and gold-palladium alloys is obtained with the help of acidic electroless baths of low metal content. The baths are prepared by suitably mixing separate solutions containing the reductant (hydroxylamine hydrochloride) or one of the desired cations respectively, with suitable additives. The stability of the baths with time is good and their replenishment easy to realize. Provided that a suitable choice of mixture of the three solutions is made, they allow the fabrication of multilayered heterostructures which could be fruitfully used for ohmic contact preparation onto n-GaAs without any initial activation step. The deposition mechanism of gold and palladium and the effect of adding palladium to gold is discussed.

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“…There have been several reports on electroless alloys, such as gold-based alloys [73][74][75][76][77], copper-based alloys [15,28,78,79], zinc-arsenic [80], silver-tungsten [81][82][83], indium-antimony [84], and iron-tin alloy [85].…”

Section: Other Alloysmentioning

confidence: 99%

“…Subsequently indium was incorporated into the film by cathodic polarization [78,79]. Several quaternary alloys were obtained by addition of cations or anionic complexes of different alloying elements to the plating baths of ternary alloys [76,[86][87][88][89].…”

Section: Gold-copper Alloysmentioning

confidence: 99%

Electroless Deposition of Alloys

Ohno

2010

Modern Electroplating

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Electroless metal deposits are mostly a binary alloy containing a metalloid such as phosphorous or boron which itself is a component of the reducing agent. Brenner and Riddel were the first to develop the process of electroless deposition of nickel-cobalt-phosphorus ternary alloy in 1946 [1]. At present, electroless alloy deposition is a practical and effective method for controlling the physicochemical properties of nickel-and cobalt-phosphorus deposits, thereby extending the range of application of electroless deposition. The recent tendency in this field is toward applications in the electronics industry. Despite an increasing number of publications concerning electroless alloy deposition, the details of its mechanisms are not clear yet.Electroless alloy deposition consists of several electrochemical partial reactions, such as cathodic deposition of the respective alloy components and the anodic oxidation of the reducing agent, although these partial reactions are not always independent of each another. Electroless metal deposition occurs under the condition that the oxidation potential of the reducing agent is less noble than the deposition potential of the metal. In case of alloy deposition, however, the deposition potential E * M of a constituent metal M in the alloy M-N shifts to a nobler potential by virtue of the negative Gibbs energy of the alloy formation DG M ; thuswhere DE M is the potential shift, E M the normal deposition potential of M, m the number of electrons, and F the Faraday constant. The potential shift DE M is of the order of 10 À2 V at most for solid-solution alloys, but sometimes it reaches up to 1 V in case of compound alloys. Therefore, it is possible to codeposit a metal that cannot be deposited otherwise as a pure metal [2]. Another requirement in electroless deposition is that the metal being deposited requires to have a catalytic activity for the anodic oxidation of the reducing agent [3]. In case of electroless alloy deposition, however, the catalytic activity depends in the last analysis on the composition of the depositing alloy. As shown in Figure 22.1, the rate of electroless nickel-iron alloy deposition using DMAB (dimethylamine borane) decreases with the increase of the iron content in the deposits. This behavior is attributable to the decrease in catalytic activity of the deposits for the anodic oxidation of DMAB, since iron is less active for this reaction than nickel [4,5]. ELECTROLESS ALLOY PLATING BATHS Nickel-Based AlloysElectroless nickel-based alloys have been produced by adding cations or anionic complexes of the alloying elements into the normal electroless nickel bath [6]. Thus, electroless nickel-phosphorus alloys containing iron [7-12], rhenium [13-20], molybdenum [21-26], tungsten [27-32], zinc [14, 33], tin [14, 23, 34], and copper [35-37] have been produced. Typical bath compositions for electroless nickelbased alloys are summarized in Table 22.1. Electroless nickel-cobalt alloys will be described in Section 22.1.2. Nickel-Iron Alloys Electroless nickel-iron-...

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Electroless Deposition of Au:In Alloys for Ohmic Contacts onto Pd‐Activated n ‐ GaAs Substrates

Cited by 8 publications

References 2 publications

Hydrogenation of Ru(1,5-cyclooctadiene)(η³-C₃H₅)₂over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

Hydrogenation of Ru(1,5-cyclooctadiene)(η³-C₃H₅)₂over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

Autocatalytic Deposition of Gold and Palladium onto n ‐ GaAs in Acidic Media

Electroless Deposition of Alloys

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Electroless Deposition of Au:In Alloys for Ohmic Contacts onto Pd‐Activated n ‐ GaAs Substrates

Cited by 8 publications

References 2 publications

Hydrogenation of Ru(1,5-cyclooctadiene)(η3-C3H5)2over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

Hydrogenation of Ru(1,5-cyclooctadiene)(η3-C3H5)2over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

Autocatalytic Deposition of Gold and Palladium onto n ‐ GaAs in Acidic Media

Electroless Deposition of Alloys

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Product

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Hydrogenation of Ru(1,5-cyclooctadiene)(η³-C₃H₅)₂over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry

Hydrogenation of Ru(1,5-cyclooctadiene)(η³-C₃H₅)₂over Black Platinum. A Low-Temperature Reactive Deposition of Submonolayer Quantities of Ruthenium Atoms on Platinum with Real Time Control over Surface Stoichiometry