Electroless atomic layer deposition of copper

Venkatraman, Kailash; Joi, Aniruddha; Dordi, Yezdi; Akolkar, Rohan

doi:10.1016/j.elecom.2018.05.007

Cited by 8 publications

(7 citation statements)

References 9 publications

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“…[12][13][14][15][16] Along these efforts, a very exciting development has been demonstrated with the first reports of an electroless (e-less) Pb and Zn ML deposition phenomenon. [17][18][19][20] Detailed analysis of these results suggest that e-lessly deposited Pb ML has a UPD-like properties 18,19 and thus pertains to a wide variety of applications already demonstrated for its UPD counterpart. Moreover, the e-less ML deposition represents a surface selective and self-terminating process which facilitates development of two-step e-less atomic layer deposition (e-less ALD) protocol.…”

mentioning

confidence: 86%

Underpotential and Electroless Pb Monolayer Deposition on Ru(0001)

Wu¹,

Ahmadi²,

Dole³

et al. 2019

J. Electrochem. Soc.

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The work reporting a detailed and comparative study of Pb UPD and Pb e-less ML deposition on Ru(0001) substrate is presented. The electrochemical results are analyzed through the scope of the adsorption isotherm formalism where parameters describing the thermodynamics of deposited Pb monolayer obtained by each process are compared. In addition to these results, the in situ STM and electrochemical quartz micro balance data are presented for each process identifying the mutual mechanistic similarities and differences between electroless Pb and underpotential Pb monolayer. Considerable applications of Ru metal in microelectronics and catalysis rise significance of these results for variety of future developments in these areas.

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mentioning

confidence: 86%

Underpotential and Electroless Pb Monolayer Deposition on Ru(0001)

Wu¹,

Ahmadi²,

Dole³

et al. 2019

J. Electrochem. Soc.

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“…An interesting development in galvanic deposition of Zn has been reported by Alkolkar and co-workers. 575 These researchers describe an EL atomic layer deposition (ALD) process that exploits an EL underpotential deposition (UPD) of Zn metal as a key process step. The process utilizes a galvanic cell in which one-half-cell contains a Cu electrode immersed in a HOOC−CHO solution and a second half-cell, connected to the first via a salt bridge, contains a second electrode immersed in Zn(OH) 4 2− solution.…”

Section: Acs Appliedmentioning

confidence: 99%

“…An interesting development in galvanic deposition of Zn has been reported by Alkolkar and co-workers . These researchers describe an EL atomic layer deposition (ALD) process that exploits an EL underpotential deposition (UPD) of Zn metal as a key process step.…”

Section: Elementsmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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“…However, recent developments in the area of electroless (e-less) deposition show promising results. They demonstrate that UPD-like monolayers can be synthesized on various catalytically relevant substrates using an e-less deposition with simple experimental routine and solution chemistry. − Several reports indicate that the e-less Pb ML (Pb ML e‑less ) deposition is of particular interest. − It occurs on substrates that do exhibit the Pb UPD phenomenon, and it can be used to modify catalytically active substrates (noble metals), improving their activity for particular reactions. , The Pb ML e‑less can also replace the UPD ML in the SLRR reaction, enabling formation of the catalyst ML on substrates with nonconductive support. In this case, the full deposition cycle requires consecutive immersion of the substrate in the solution for the Pb ML e‑less deposition (first step) and then in the solution for the SLRR, that is, catalyst deposition (second step).…”

Section: Introductionmentioning

confidence: 99%

Electroless Pb Monolayer Deposition—Prelude for Further Advances in Catalyst Monolayer Synthesis via Surface Limited Redox Replacement Reaction

Ahmadi

Dole

et al. 2021

ACS Catal.

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We point out a novel opportunity for catalyst monolayer and core–shell structures synthesis via the surface limited redox replacement (SLRR) reaction. It is enabled by discovery of an electroless Pb monolayer deposition phenomenon whose fundamentals and practical aspects are presented. The particular benefit of this synthesis approach is for metal substrates which are not part of broadly conductive supports such as metal nanoparticles embedded in various oxides or zeolites. Examples of the catalyst monolayer deposition via SLRR of electrolessly deposited Pb monolayer are presented under the auspices of a two-step electroless atomic layer deposition process (e-less ALD). Each cycle of the e-less ALD produces a precise submonolayer amount of catalyst deposit demonstrating its potential for a broad range of applications.

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Electroless atomic layer deposition of copper

Cited by 8 publications

References 9 publications

Underpotential and Electroless Pb Monolayer Deposition on Ru(0001)

Underpotential and Electroless Pb Monolayer Deposition on Ru(0001)

Electroless Metallization of the Elements: Survey and Progress

Electroless Pb Monolayer Deposition—Prelude for Further Advances in Catalyst Monolayer Synthesis via Surface Limited Redox Replacement Reaction

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