We show that two distinct methods, electropolymerization and initiated chemical vapour deposition (iCVD), can be adapted to generate ultrathin polymers (30-50 nm thick) at three dimensionally (3D) porous conductive substrates comprising B300 lm-thick carboncoated silica fiber paper (C@SiO 2 ). We selected 1,3,5-trivinyl-1,3,5trimethylcyclotrisiloxane (''V3D3'') as a common monomer amenable to polymerization by either approach. Electroanalytical and electrical measurements confirm that all carbon surfaces are passivated with electronically insulating poly(V3D3) coatings.The Achilles heel that trips up all-solid-state 3D energy-storage devices resides in the inability to form ultrathin dielectrics with high fidelity when conformally coating non-line-of-sight substrates such as ultraporous scaffolds and architectures. Of the limited fabrication protocols available to paint polymers throughout macroscopically thick structures while ''blind,'' electrodeposition and initiated chemical vapour deposition are the most compelling. Both methods offer conditions under which growth can be limited thus ensuring that monomer can access all of the internal surfaces. The critical chemical, physical, and electrical properties of nanoscale polymers generated by such methods-well-studied on planar substrates-must also be validated for the polymers when expressed in 3D. These data are necessary to demonstrate performance as a solid-state dielectric in 3D batteries and capacitors.