The cathodic electrodeposition technique has been applied to the binary Cu͑II) ϩ Sr͑II) system in nitrate-dimethylsulfoxide solution, with use of voltammetry as a prerequisite to thin-film synthesis. The electrochemical study was performed under diffusion and convection regimes as a function of the concentration ratio r ϭ ͓Sr͑II͔͒/͓Cu͑II)] and resulted in the choice of a solution with r ϭ 5 for deposition experiments. Films were grown potentiostatically and galvanostatically at room temperature on silver tapes. Electrolytic deposition was followed by annealing for 4 min in air at 880°C. Both series were then analyzed by chronoamperometry, X-ray diffraction, electron microprobe analysis, and scanning electron microscopy. Inside the parameter ranges determined by electrochemistry, as-grown and annealed films were homogeneous, pinhole-free, and adherent. The best quality was seen in the galvanostatic mode due to accurate control of the overall deposition rate. Copper was electrodeposited as a metal by diffusion-limited reduction of Cu͑II͒ ions, while strontium was precipitated as a hydroxide by electrogeneration of base in the water reduction range. Codeposition was found to give rise to separated phases, involving a microcrystalline strontium hydroxide layer surrounding a nanocrystalline copper underlayer, which was surrounded by copper surface clusters. Annealed films were composed of various mixtures of strontium cuprate phases, whose composition was directly related to the strontiumcopper atomic ratio in the precursor films.