Electrodeposition of Cu–Sn alloys: theoretical and experimental approaches

Heidari, G.; Khoie, S.M. Mousavi; Abrishami, M. Ebrahimizadeh; Javanbakht, Mehran

doi:10.1007/s10854-014-2636-1

Cited by 20 publications

(16 citation statements)

References 40 publications

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“…7. The data show that Sn content increases as the deposition potential becomes more cathodic and Cu 2+ concentration in the electrolyte is lowered, as expected based on polarisation experiments carried out in this work and previously reported results [32,31,25,14,49,10,9]. At a copper concentration of 0.063 mol dm À3 , addition of BA significantly increases the tin content only at E = -0.54 V. Otherwise this additive has a limited effect on the deposit composition.…”

Section: Potentiostatic Depositionsupporting

confidence: 89%

“…In the last decades, these alloys have found various new applications, such as shape memory materials [5] or lithium-ion battery anodes [6][7][8], thanks to improvement in deposit morphology, composition and structure [9]. Furthermore, semi-conducting Cu-Sn-S alloys prepared by sulfurisation of electrodeposited Cu-Sn have been recently proposed as absorbers in solar cells [10]. Hence, deposition of Cu-Sn alloys remains a relevant topic for both the academic and industrial communities.…”

Section: Introductionmentioning

confidence: 99%

“…Consequently, a lot of efforts have been devoted to achieving cyanide-free formulations with the same benefits of the one currently employed. Among the alternatives that have been hitherto studied, it is possible to find sulphate [14][15][16][17][18][19][20][21][22], sorbitol [23], pyrophospate [24] and citrate based [10] formulations. More recently, choline chloride based deep eutectic solvents have been used to deposit Cu-Sn alloys with promising results [25].…”

Section: Introductionmentioning

confidence: 99%

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Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Bengoa

Pary

Conconi

et al. 2017

Electrochimica Acta

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Deposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing small amounts of benzyl alcohol was investigated. Polarisation experiments (cylic and linear sweep voltammetry) were carried out using a rotating disc electrode to identify the reduction and dissolution processes that take place in the system and to determine the effect of the solution constituents on them. Potentiostatic deposition was performed onto a rotating cylinder electrode and the resulting deposits were charactised using SEM and XRD. The results showed that co-deposition of copper and tin is possible even at potentials less cathodic than tin discharge potential. The latter was attributed to the underpotential deposition of Sn 2+ on a copper substrate. Smooth and compact deposits were obtained at various deposition potentials and Cu 2+ concentrations, with Sn contents between 1.6 -62.4 wt.%. Several stable phases, such as pure copper, a-CuSn, e-Cu 3 Sn and h 0 -Cu 6 Sn 5 phase, were detected at different operating conditions. Finally, it was found that BA increases the amount of tin in the deposit when Cu 2+ concentrations in the solution is kept low, especially at high overpotentials. This additive also inhibits the formation of dendrites and reduces surface roughness.

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Section: Potentiostatic Depositionsupporting

confidence: 89%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Bengoa

Pary

Conconi

et al. 2017

Electrochimica Acta

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show abstract

“…Trabalhos anteriores do nosso grupo de pesquisa já mostraram que é possível a obtenção de revestimentos de ligas de cobre utilizando banhos não agressivos ao ambiente, apresentando brilho e boa aderência [5,7,10]. Para a eletrodeposição de ligas Cu-Sn, contudo, existem poucos trabalhos utilizando complexantes não agressivos [11][12][13]. Em alguns casos, estas substâncias têm sido estudadas apenas como aditivo ao banho e não como agente complexante [14][15].…”

Section: Introductionunclassified

Produção e caracterização de revestimentos de ligas metálicas Cu-Sn em banho eletrolítico contendo glicina: ensaios preliminares

2019

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RESUMO Os problemas relacionados à corrosão são frequentes, podendo ocorrer nas mais variadas áreas, tais como, nas indústrias química, petroquímica, naval, de construção civil e automobilística, dentre outros setores produtivos. Portanto, métodos para prevenir a corrosão devem ser empregados para evitar a perda de materiais e o uso de revestimentos metálicos tem servido bastante a este propósito. A produção de revestimentos metálicos permite modificar a superfície do substrato levando à formação de um material funcional que apresenta as propriedades e características desejadas, no caso, resistência à corrosão. Contudo, esses revestimentos são geralmente produzidos usando banhos tóxicos a base de cianeto, o que eleva o custo do processo devido ao tratamento posterior dos rejeitos gerados. O presente trabalho propõe um estudo inicial para a produção de revestimentos de ligas de Cu-Sn com propriedades anticorrosivas, a partir de banho eletrolítico menos agressivo, apresentando diferentes concentrações iônicas de cobre e estanho. Os revestimentos foram eletrodepositados em substrato de aço-carbono, utilizando eletrólitos ácidos contendo CuCl2, SnCl2 e glicina. Estes revestimentos foram posteriormente caracterizados através das técnicas de microscopia eletrônica de varredura (MEV), espectroscopia de raios X por energia dispersiva (EDS), espectroscopia de impedância eletroquímica (EIE) e polarização potenciodinâmica. Os resultados de EIE mostraram que os filmes produzidos com maiores teores de cobre apresentaram um aumento nos valores da resistência de transferência de carga (Rtc). Contudo, os ensaios de polarização mostraram que estes filmes não atuaram como revestimentos protetores. As análises morfológicas evidenciaram a formação de revestimentos porosos, o que pode explicar seu pobre comportamento eletroquímico.

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“…Moreover, prolonged use of cyanide baths also leads to a decrease in the quality of the produced coating 4 . Therefore, there are several works concerning the use of alternative, environmentally-friendly electrolytic baths, that can be as efficient as cyanide ions in producing the metallic coatings 4,[6][7][8][9][10] . Among the environmentally friendly electrolytes currently used, citrates, gluconates, sulfamates, tartrates and glycinates are the most studied baths for the electrodeposition of copper alloy coatings 7,[11][12][13] .…”

Section: Introductionmentioning

confidence: 99%

Cu-Sn Coatings Produced Using Environmentally Non-Aggressive Electrolyte Containing Sodium Tartrate

2017

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This work proposes the production of Cu-Sn alloy coatings with anticorrosive properties, using an environmentally non-aggressive bath. The coatings were electrodeposited on carbon steel substrate AISI 1020 using an electrolyte containing CuCl 2 and SnCl 2 , and sodium tartrate as the complexant agent. The produced coatings were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), inductively coupled plasma optical emission spectrometry (ICPOES) and electrochemical impedance spectroscopy (EIS). The film showing the highest corrosion resistance was obtained using j = 100 Am -2 . This coating was composed by 95.18 % m/m Cu and 4.83 % m/m Sn, and presented a uniform surface, without defects and small grain sizes. These characteristics probably contributed to the formation of Cu-Sn protective film onto steel substrate from a tartrate bath.

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Electrodeposition of Cu–Sn alloys: theoretical and experimental approaches

Cited by 20 publications

References 40 publications

Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Produção e caracterização de revestimentos de ligas metálicas Cu-Sn em banho eletrolítico contendo glicina: ensaios preliminares

Cu-Sn Coatings Produced Using Environmentally Non-Aggressive Electrolyte Containing Sodium Tartrate

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