Electrodeposition of CoWP film

Dulal, S.M.S.I.; Yun, Hongseok; Shin, Chee Burm; Kim, Chang‐Koo

doi:10.1016/j.electacta.2007.08.006

Cited by 56 publications

(22 citation statements)

References 52 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…After a few seconds, nuclei of Co-Cu form and hydrogen reduction starts on the nuclei of the deposited Co-Cu alloys. Therefore, with the progress of electrodeposition, the Co-Cu nuclei get larger and more hydrogen evolution occurs, which causes the deviations of experimental data from theoretical ones when t/t m becomes greater than 1.5 [27]. This result indicates that in the initial deposition stage of Co-Cu on FTO surfaces, all the reaction sites on the surface of FTO substrate are activated simultaneously and the number of nuclei formed is saturated instantaneously.…”

Section: Resultsmentioning

confidence: 41%

See 1 more Smart Citation

A study of the electrodeposition of Co–Cu alloys thin films on FTO substrate

Mentar¹

2011

Ionics

View full text Add to dashboard Cite

In this work, the early stages and the properties of the electrodeposition process of Co-Cu alloys thin films on a fluorine-doped tin oxide (FTO)-coated conducting glass substrate from a sulfate bath were investigated using conventional electrochemical techniques and X-ray diffraction technique (XRD). FTO was chosen as a foreign substrate because of its high transparence and its properties as inert material. Within the potential range analyzed, the kinetics of the Co-Cu electrodeposition corresponded to a model including instantaneous nucleation on active sites and diffusion controlled cluster growth. The number of active sites of the substrate, N 0 , and the diffusion coefficient, D, were determined from the analysis of potentiostatic current transients on the basis of existing theoretical models. XRD patterns of the Co-Cu alloys thin films display fcc and hcp phase, with peaks quite close to those of the Co phase (fcc and hcp). Therefore, the variation of the composition of thin films alloy is possible depending on the deposition potential.

show abstract

Section: Resultsmentioning

confidence: 41%

“…According to the instantaneous nucleation model, the D is related to the i max and the t max [27] by…”

Section: Resultsmentioning

confidence: 99%

A study of the electrodeposition of Co–Cu alloys thin films on FTO substrate

Mentar¹

2011

Ionics

View full text Add to dashboard Cite

show abstract

“…Various metallic films have been proposed as capping/barrier layers, including NiReP [7], CoWP [8][9][10][11][12][13], CoWB [14], NiWB [15], NiCoP [16], CoMoP [17], and so on. These films were formed by using wet chemical methods such as electroless and electro plating.…”

Section: Introductionmentioning

confidence: 99%

Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors

Namkoung

Lee

Son

et al. 2010

Korean J. Chem. Eng.

Self Cite

View full text Add to dashboard Cite

CoWP films, used as a capping layer for a copper interconnection, were electrodeposited using alkalimetal-free precursors, and the effect of the electrolyte concentration on the film characteristics such as the thickness, composition, and microstructure was investigated. The current density and the film thickness increased with the concentration of cobalt, tungsten, and phosphorous precursors. When the cobalt ion concentration in the electrolyte was increased from 0.01 to 0.09 M, the cobalt content in the film increased from 67 to 89 at%, while the tungsten and phosphorous contents decreased from 16 to 0.7 and 17 to 10 at%, respectively. The tungsten and phosphorous contents also increased as their corresponding concentrations increased in the electrolyte. Microstructural analyses showed that the tungsten and phosphorous content in the film greatly affected the crystallinity of the CoWP films electrodeposited using alkali-metal-free precursors.

show abstract

“…Recently, it has been reported that electrodeposition method has some advantages over electroless deposition such as lower processing temperature, better control over the deposition technique and thus, a wide range of compositions [12][13][14][15]. In the present work, Co-W-P coatings have been made on plain carbon steel by the electrodeposition method and their microstructures, hardness and corrosion protective properties have been studied.…”

Section: Introductionmentioning

confidence: 97%

“…Co-W-P thin films can be fabricated by both electroless [8][9][10][11] and electrochemical deposition methods [12][13][14][15]. Recently, it has been reported that electrodeposition method has some advantages over electroless deposition such as lower processing temperature, better control over the deposition technique and thus, a wide range of compositions [12][13][14][15].…”

Section: Introductionmentioning

confidence: 98%