1999
DOI: 10.1016/s0040-6090(99)00168-6
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Electrodeposited thin mercury films on Pt–Ir alloy electrodes

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Cited by 18 publications
(10 citation statements)
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“…34 It generally describes any one of the two 5 different processes: (i) direct electroless deposition, in which the metal is directly reduced by a reducing agent, or (ii) a galvanic displacement reaction where the electrons to reduce the gold ions are supplied by the dissolution of the substrate. [38][39][40][41] In the present work, direct electroless deposition method is used for the 10 deposition of AuNPs on GO and ERGO films. The HAuCl 4 is used as a precursor and NH 2 OH is used as the reducing agent.…”
Section: Introductionmentioning
confidence: 99%
“…34 It generally describes any one of the two 5 different processes: (i) direct electroless deposition, in which the metal is directly reduced by a reducing agent, or (ii) a galvanic displacement reaction where the electrons to reduce the gold ions are supplied by the dissolution of the substrate. [38][39][40][41] In the present work, direct electroless deposition method is used for the 10 deposition of AuNPs on GO and ERGO films. The HAuCl 4 is used as a precursor and NH 2 OH is used as the reducing agent.…”
Section: Introductionmentioning
confidence: 99%
“…Pure platinum, rhodium and iridium, and alloys of platinum-iridium and platinum-rhodium have been widely used to prepare microelectrodes [1][2][3][4][5][6], catalysts used in petroleum cracking industry [7][8]. It is well known that when solid metals are placed in contact with mercury, a variety of physicochemical changes may occur, e.g., complete or partial dissolution of the solid, intermetallic compounds formation at the liquid-solid interface or in the solution, grain boundary grooving, and liquid metal embrittlement.…”
Section: Introductionmentioning
confidence: 99%
“…It is well known that when solid metals are placed in contact with mercury, a variety of physicochemical changes may occur, e.g., complete or partial dissolution of the solid, intermetallic compounds formation at the liquid-solid interface or in the solution, grain boundary grooving, and liquid metal embrittlement. Such changes may also cause structural deterioration of the solid surface [2][3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%
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