Electrodeposited gold–copper core–shell nanowires for high sensitivity DNA detection

Spain, Elaine; McCooey, Andrea; Dolan, Ciarán; Bagshaw, Heath; Leddy, Neal; Keyes, Tia E.; Forster, Robert J.

doi:10.1039/c4an01222d

Cited by 8 publications

(5 citation statements)

References 16 publications

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“…12 However, CuNWs are very sensitive to oxygen that greatly hinders their developments. Althrough coating a thin layer of materials (Ni, [13][14][15][16] Pt, 17,18 Au, 13,19 Zn, 20 Sn, 20 Ag, 21,22 AZO, 23 carbon materials, 24-27 et al) on CuNWs is an effective way to prevent the oxidation of CuNWs, these methods are usually electrodeposition methods, chemical or physical vapor deposition (CVD or PVD), one pot or two pot method at high temperature (210 °C), et al It is highly dependent on the costly equipments and rigorous reaction conditions, which are not advantageous in wide applications in industry (see the summary of core-shell NWs based on CuNWs in Table S2). Flexible polymer matrix (such as polydimethylsiloxane (PDMS), polyurethane (PU) elastomer, styrene-butadiene-styrene (SBS) elastomer) plays a key role in determining the shape and elasticity of e-skin.…”

Section: Introductionmentioning

confidence: 99%

“…12 However, CuNWs are very sensitive to oxygen which greatly hinders their development. Although coating a thin layer of materials (Ni, [13][14][15][16] Pt, 17,18 Au, 13,19 Zn, 20 Sn, 20 Ag, 21,22 AZO, 23 carbon materials, [24][25][26][27] etc.) on CuNWs is an effective way to prevent the oxidation of CuNWs, these methods are usually electrodeposition methods, chemical or physical vapor deposition (CVD or PVD), one pot or two pot methods at high temperature (210 1C), etc.…”

Section: Introductionmentioning

confidence: 99%

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Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure

et al. 2015

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Flexible electronic skin (e-skin) have been widely researched due to their potential applications in wearable electronics, robotic systems, biomedicines, et al. For realization of lower cost of the e-skin, copper nanowires (CuNWs) are often served as conductive fillers since their high conductivity and flexibility. However, CuNWs are very sensitive to oxygen that greatly hinders their developments. To solve this issue, a facile galvanic replacement reaction without any heating, stirring or dispersant was performed to coat a thin layer of silver (20 nm) on the surface of CuNWs and Cu-Ag core-shell nanowires (Cu-Ag NWs) with excellent oxidation resistance were obtained and served as conductive fillers for e-skin. To further increase the sensitivity and reduce the response time and detection limit, micro-structure of the surface of rose petal was replicated and introduced onto 2D polydimethylsiloxane (PDMS) surface. The bio-inspired piezoresistive e-skin demonstrates high sensitivity (1.35 kPa -1 ), very low detection limit (< 2 Pa), very low response time and relaxation time (36 ms and 30 ms) and outstanding working stability (more than 5000 cycles). The high performance e-skin has extensive applications in voice recognition, wrist pulses monitoring and detection of spatial distribution of pressure.−1 ), fast response (<500 ms) and low detection limit (20 mg). 29 Wang, et al. replicated the surface of silk and constructed a piezoresistive e-skin, which can be used as voice The defining feature of our design is that the length of the CuNWs should not larger than 20 μm. Therefore, a lower EDA concentration (95 mM) and shorter reaction time (<1.0 h) was performed to synthesis shorter CuNWs. Fig.1a and b show the

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure

et al. 2015

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“…Hollow Cu nanowires have been fabricated experimentally [13–14], and studied by means of simulations [15–17]. Our study of high temperature stability of these nanowires shows interesting results.…”

Section: Introductionmentioning

confidence: 93%

Plasticity-mediated collapse and recrystallization in hollow copper nanowires: a molecular dynamics simulation

Dutta¹,

Raychaudhuri²,

Saha‐Dasgupta³

2016

Beilstein J. Nanotechnol.

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SummaryWe study the thermal stability of hollow copper nanowires using molecular dynamics simulation. We find that the plasticity-mediated structural evolution leads to transformation of the initial hollow structure to a solid wire. The process involves three distinct stages, namely, collapse, recrystallization and slow recovery. We calculate the time scales associated with different stages of the evolution process. Our findings suggest a plasticity-mediated mechanism of collapse and recrystallization. This contradicts the prevailing notion of diffusion driven transport of vacancies from the interior to outer surface being responsible for collapse, which would involve much longer time scales as compared to the plasticity-based mechanism.

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“…Copper nanowires (CuNWs) have been proven as a potential replacement for the indium tin oxide (ITO) in stretchable conductive films due to their sufficient mechanical flexibility, high conductivity, and cost-effectiveness. − Despite these advantages, the obstacle hampering the real-world application of CuNWs is oxidation, which will produce copper oxide and decrease the conductivity and transparency of the conductors. − Herein, it is necessary to improve the oxidation stability of the CuNWs network. Several coating methods have been reported to protect the CuNWs against oxidation, like encapsulating the CuNWs in shells of organic materials, , polymers, , metals, ,, or embedding the CuNWs in a flexible substrate. ,, …”

Section: Introductionmentioning

confidence: 99%

Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

Zhang

Jiu

et al. 2019

Inorg. Chem.

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Copper nanowires (CuNWs) are considered a promising alternative to indium tin oxide due to their cost-effectiveness as well as high conductivity and transparency. However, the practical applications of copper-based conductors are greatly limited due to their rapid oxidation in atmosphere. Herein, a facile adsorption and decomposition process is developed for galvanic replacement free and large-scale synthesis of highly stable Cu@Ag core–shell nanowires. First, Ag-amine complex ([Ag(NH2R)2]+) as silver source adsorbs on CuNWs surface, and Cu@Ag-amine complex core–shell structure is formed. After that, Ag-amine complex is easily decomposed to pure Ag shell through a simple thermal annealing under air. By adjusting the concentration of Ag-aminein CuNWs solution, Cu@Ag core–shell nanowires with different thickness of silver shell can be easily obtained. The obtained core–shell nanowires exhibit high stability for at least 500 h at high temperature (140 °C) and high humidity (85 °C, 85% RH) due to the protection of Ag shell. More importantly, the conductivity and transparency of Cu@Ag nanowires-based conductors is similar to that of pure CuNWs. The large-scale and facile synthesis of Cu@Ag core–shell nanowires provides a new method to prepare stable metallic core–shell nanowires.

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Electrodeposited gold–copper core–shell nanowires for high sensitivity DNA detection

Cited by 8 publications

References 16 publications

Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure

Cu–Ag core–shell nanowires for electronic skin with a petal molded microstructure

Plasticity-mediated collapse and recrystallization in hollow copper nanowires: a molecular dynamics simulation

Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

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